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Craig Armiento

Researcher at University of Massachusetts Lowell

Publications -  90
Citations -  1269

Craig Armiento is an academic researcher from University of Massachusetts Lowell. The author has contributed to research in topics: Laser & Quantum well. The author has an hindex of 20, co-authored 84 publications receiving 1232 citations. Previous affiliations of Craig Armiento include Verizon Communications & Raytheon Integrated Defense Systems.

Papers
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Journal ArticleDOI

Effect of electric fields on excitons in a coupled double-quantum-well structure.

TL;DR: From the measured exciton transitions, splittings of the quantum confined levels in a coupled double-quantum-well structure were derived without recourse to a theoretical model.
Journal ArticleDOI

Passive coupling of InGaAsP/InP laser array and singlemode fibres using silicon waferboard

TL;DR: In this article, passive alignment of semiconductor lasers and single-mode fibres has been achieved using a micromachined silicon subtrate, which offers the potential for low-cost optoelectronic device packaging and a means for dense hybrid integration of optical components required for multifibre, multichip systems.
Journal ArticleDOI

Gigabit transmitter array modules on silicon waferboard

TL;DR: In this paper, a four-channel InGaAsP/InP laser array, driver array, and optical fibers are all spaced on 350-mu m centers, which results in a 4-channel transmitter array that fits within a width of only 2 mm.
Journal ArticleDOI

Impact ionization in (100), (110), and (111) oriented InP avalanche photodiodes

TL;DR: In this paper, the impact ionization process in the 〈100〉, 》110〉 and 〉111〉 crystallographic directions in InP has been investigated by analysis of photomultiplication and multiplication noise data from InP avalanche photodiodes.
Patent

Method and device for passive alignment of diode lasers and optical fibers

TL;DR: In this article, a method of passively aligning optical receiving elements such as fibers to the active elements of a light generating chip includes the steps of forming two front and one side pedestal structures on the surface of a substrate body, defining a vertical sidewall of the chip to form a mating channel having an edge at a predetermined distance from the first active element, mounting the chip epi-side down on the substrate surface, and positioning the fibers in fiber-receiving channels so that a center line of each fiber is aligned to a centre line of a respective active element.