Vincent J. Barry

TL;DR: In this article, passive alignment of semiconductor lasers and single-mode fibres has been achieved using a micromachined silicon subtrate, which offers the potential for low-cost optoelectronic device packaging and a means for dense hybrid integration of optical components required for multifibre, multichip systems.

TL;DR: In this article, a method of passively aligning optical receiving elements such as fibers to the active elements of a light generating chip includes the steps of forming two front and one side pedestal structures on the surface of a substrate body, defining a vertical sidewall of the chip to form a mating channel having an edge at a predetermined distance from the first active element, mounting the chip epi-side down on the substrate surface, and positioning the fibers in fiber-receiving channels so that a center line of each fiber is aligned to a centre line of a respective active element.

TL;DR: In this article, a semiconductor wafer, bearing a multilayered first level metalization characterized by a tungsten alloy top layer, is annealed in a suitable ambient so as to form a distinctly colored superficial film atop the first-level metalization.

TL;DR: In this paper, a method of passively aligning optical receiving elements such as fibers to the active elements of a light-generating chip is proposed, which includes the steps of forming two front pedestals and one side pedestal structures on the surface of a substrate body, defining a vertical sidewall of the chip to form a mating channel having an edge at a predetermined distance from the first active element, mounting the chip epi-side down on the substrate surface, and positioning the fibers in fiber-receiving channels so that a center line of each fiber is aligned to

TL;DR: In this article, the alignment features fabricated on the surface of a silicon chip have been used to passively align the active regions of an individually addressable InGaAsPIInP laser array to four single-mode fibers.