D
Dan Li
Researcher at Peking University
Publications - 20
Citations - 330
Dan Li is an academic researcher from Peking University. The author has contributed to research in topics: Piezoresistive effect & Pressure sensor. The author has an hindex of 7, co-authored 20 publications receiving 282 citations. Previous affiliations of Dan Li include University of Colorado Boulder & Stanford University.
Papers
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Journal ArticleDOI
Enhancing Flow Boiling Heat Transfer in Microchannels for Thermal Management with Monolithically-Integrated Silicon Nanowires
Dan Li,Gensheng Wu,Gensheng Wu,Wei Wang,Yunda Wang,Dong Liu,Dongtang Zhang,Yunfei Chen,G. P. Peterson,Ronggui Yang +9 more
TL;DR: Silicon nanowires were synthesized in situ in parallel silicon microchannel arrays for the first time to suppress the flow instability and to augment flow boiling heat transfer.
Journal ArticleDOI
A Monolithic Piezoresistive Pressure-Flow Sensor With Integrated Signal-Conditioning Circuit
Dan Li,Ting Li,Dacheng Zhang +2 more
TL;DR: In this paper, a monolithic integrated pressure-flow sensor with on-chip signal-conditioning CMOS circuit has been developed for simultaneous measurements of pressure and flow rates, which is used in automatic control system.
Journal ArticleDOI
Wafer-scale fabrication of silicon nanowire arrays with controllable dimensions
TL;DR: In this article, a novel and facile method was successfully developed to fabricate wafer-scale Si nanowire arrays with well-controlled sizes through the in-situ porous anodic alumina (PAA) template-assisted wet-etching process.
Journal ArticleDOI
Origin of thermal depolarization in piezoelectric ceramics
TL;DR: In this paper, five of the most representative piezoelectric systems with different Curie points were selected to study the origin of thermal depolarization in piezolectric ceramics.
Journal ArticleDOI
Monolithic integration of a micromachined piezoresistive flow sensor
TL;DR: In this paper, a monolithic integrated piezoresistive flow sensor is presented, which was fabricated with an intermediate CMOS (complementary metaloxide semiconductor) MEMS (micro electro mechanical system) process compatible with integrated pressure sensors.