We examine the current performance and future demands of interconnects to and on silicon chips. We compare electrical and optical interconnects and project the requirements for optoelectronic and optical devices if optics is to solve the major problems of interconnects for future high-performance silicon chips. Optics has potential benefits in interconnect density, energy, and timing. The necessity of low interconnect energy imposes low limits especially on the energy of the optical output devices, with a ~ 10 fJ/bit device energy target emerging. Some optical modulators and radical laser approaches may meet this requirement. Low (e.g., a few femtofarads or less) photodetector capacitance is important. Very compact wavelength splitters are essential for connecting the information to fibers. Dense waveguides are necessary on-chip or on boards for guided wave optical approaches, especially if very high clock rates or dense wavelength-division multiplexing (WDM) is to be avoided. Free-space optics potentially can handle the necessary bandwidths even without fast clocks or WDM. With such technology, however, optics may enable the continued scaling of interconnect capacity required by future chips.

Device Requirements for Optical Interconnects to Silicon Chips

International Technology Roadmap for Semiconductors 2003の要求清浄度について － シリコンウエハ表面と雰囲気環境に要求される清浄度, 分析方法の現状について －

With power density and hence cooling costs rising exponentially, processor packaging can no longer be designed for the worst case, and there is an urgent need for runtime processor-level techniques that can regulate operating temperature when the package's capacity is exceeded. Evaluating such techniques, however, requires a thermal model that is practical for architectural studies.This paper describes HotSpot, an accurate yet fast model based on an equivalent circuit of thermal resistances and capacitances that correspond to microarchitecture blocks and essential aspects of the thermal package. Validation was performed using finite-element simulation. The paper also introduces several effective methods for dynamic thermal management (DTM): "temperature-tracking" frequency scaling, localized toggling, and migrating computation to spare hardware units. Modeling temperature at the microarchitecture level also shows that power metrics are poor predictors of temperature, and that sensor imprecision has a substantial impact on the performance of DTM.

Temperature-aware microarchitecture

We characterize high-performance streaming applications as a new and distinct domain of programs that is becoming increasingly important. The StreamIt language provides novel high-level representations to improve programmer productivity and program robustness within the streaming domain. At the same time, the StreamIt compiler aims to improve the performance of streaming applications via stream-specific analyses and optimizations. In this paper, we motivate, describe and justify the language features of StreamIt, which include: a structured model of streams, a messaging system for control, a re-initialization mechanism, and a natural textual syntax.

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StreamIt: A Language for Streaming Applications

The design and performance of next-generation chip multiprocessors (CMPs) will be bound by the limited amount of power that can be dissipated on a single die We present photonic networks-on-chip (NoC) as a solution to reduce the impact of intra-chip and off-chip communication on the overall power budget A photonic interconnection network can deliver higher bandwidth and lower latencies with significantly lower power dissipation We explain why on-chip photonic communication has recently become a feasible opportunity and explore the challenges that need to be addressed to realize its implementation We introduce a novel hybrid micro-architecture for NoCs combining a broadband photonic circuit-switched network with an electronic overlay packet-switched control network We address the critical design issues including: topology, routing algorithms, deadlock avoidance, and path-setup/tear-down procedures We present experimental results obtained with POINTS, an event-driven simulator specifically developed to analyze the proposed idea, as well as a comparative power analysis of a photonic versus an electronic NoC Overall, these results confirm the unique benefits for future generations of CMPs that can be achieved by bringing optics into the chip in the form of photonic NoCs

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Photonic Networks-on-Chip for Future Generations of Chip Multiprocessors

Increasing levels of microprocessor power dissipation call for new approaches at the architectural level that save energy by better matching of on-chip resources to application requirements. Selective cache ways provides the ability to disable a subset of the ways in a set associative cache during periods of modest cache activity, while the full cache may remain operational for more cache-intensive periods. Because this approach leverages the subarray partitioning that is already present for performance reasons, only minor changes to a conventional cache are required, and therefore, full-speed cache operation can be maintained. Furthermore, the tradeoff between performance and energy is flexible, and can be dynamically tailored to meet changing application and machine environmental conditions. We show that trading off a small performance degradation for energy savings can produce a significant reduction in cache energy dissipation using this approach.

Selective cache ways: on-demand cache resource allocation

As clock frequency increases and feature size decreases, clock distribution and wire delays present a growing challenge to the designers of singly-clocked, globally synchronous systems. We describe an alternative approach, which we call a multiple clock domain (MCD) processor, in which the chip is divided into several clock domains, within which independent voltage and frequency scaling can be performed. Boundaries between domains are chosen to exploit existing queues, thereby minimizing inter-domain synchronization costs. We propose four clock domains, corresponding to the front end , integer units, floating point units, and load-store units. We evaluate this design using a simulation infrastructure based on SimpleScalar and Wattch. In an attempt to quantify potential energy savings independent of any particular on-line control strategy, we use off-line analysis of traces from a single-speed run of each of our benchmark applications to identify profitable reconfiguration points for a subsequent dynamic scaling run. Using applications from the MediaBench, Olden, and SPEC2000 benchmark suites, we obtain an average energy-delay product improvement of 20% with MCD compared to a modest 3% savings from voltage scaling a single clock and voltage system.

/pdf/energy-efficient-processor-design-using-multiple-clock-24ulf8ojka.pdf

Energy-efficient processor design using multiple clock domains with dynamic voltage and frequency scaling

Conventional microarchitectures choose a single memory hierarchy design point targeted at the average application. In this paper, we propose a cache and TLB layout and design that leverages repeater insertion to provide dynamic low-cost configurability trading off size and speed on a per application phase basis. A novel configuration management algorithm dynamically detects phase changes and reacts to an application's hit and miss intolerance in order to improve memory hierarchy performance while taking energy consumption into consideration. When applied to a two-level cache and TLB hierarchy at 0.1 /spl mu/m technology, the result is an average 15% reduction in cycles per instruction (CPI), corresponding to an average 27% reduction in memory-CPI, across a broad class of applications compared to the best conventional two-level hierarchy of comparable size. Projecting to sub-.1 /spl mu/m technology design considerations that call for a three-level conventional cache hierarchy for performance reasons, we demonstrate that a configurable L2/L3 cache hierarchy coupled with a conventional LI results in an average 43% reduction in memory hierarchy energy in addition to improved performance.

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Memory hierarchy reconfiguration for energy and performance in general-purpose processor architectures

Intrachip optical interconnects (OIs) have the potential to outperform electrical wires and to ultimately solve the communication bottleneck in high-performance integrated circuits. Performance targets and critical directions for ICs progress are yet to be fully explored. In this paper, the International Technology Roadmap for Semiconductors (ITRS) is used as a reference to explore the requirements that silicon-based ICs must satisfy to successfully outperform copper electrical interconnects (IEs). Considering the state-of-the-art devices, these requirements are extended to specific IC components

On-Chip Optical Interconnect Roadmap: Challenges and Critical Directions

Although silicon optical technology is still in its formative stages, and the more near-term application is chip-to-chip communication, rapid advances have been made in the development of on-chip optical interconnects. In this paper, we investigate the integration of CMOS-compatible optical technology to on-chip cache-coherent buses in future CMPs. While not exhaustive, our investigation yields a hierarchical opto-electrical system that exploits the advantages of optical technology while abiding by projected limitations. Our evaluation shows that, for the applications considered, compared to an aggressive all-electrical bus of similar power and area, significant performance improvements can be achieved using an opto-electrical bus. This performance improvement is largely dependent on the application?s bandwidth demand and on the number of implemented wavelengths per optical waveguide. We also present a number of critical areas for future work that we discover in the course of our research.

/pdf/leveraging-optical-technology-in-future-bus-based-chip-aztr4nwvmt.pdf

David H. Albonesi

Papers

Selective cache ways: on-demand cache resource allocation

Energy-efficient processor design using multiple clock domains with dynamic voltage and frequency scaling

Memory hierarchy reconfiguration for energy and performance in general-purpose processor architectures

On-Chip Optical Interconnect Roadmap: Challenges and Critical Directions

Leveraging Optical Technology in Future Bus-based Chip Multiprocessors