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David Reay

Researcher at Newcastle University

Publications -  107
Citations -  2822

David Reay is an academic researcher from Newcastle University. The author has contributed to research in topics: Heat pipe & Heat transfer. The author has an hindex of 24, co-authored 102 publications receiving 2343 citations. Previous affiliations of David Reay include Brunel University London & University of Nottingham.

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Book

Heat Pipes: Theory, Design and Applications

TL;DR: The Heat Pipes 6th Edition as discussed by the authors is an essential guide for practicing engineers and an ideal text for postgraduate students, taking a highly practical approach to the design and selection of heat pipes.
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Novel ventilation cooling system for reducing air conditioning in buildings.: Part I: testing and theoretical modelling

TL;DR: In this paper, a latent heat storage unit incorporating heat pipes embedded in phase change material (PCM) is developed and tested for a novel application in low energy cooling of buildings.
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Opportunities for low-grade heat recovery in the UK food processing industry

TL;DR: A review of the best available technologies for recovery of waste heat is provided, ranging from heat transfer between source and sink, to novel technologies for the generation of electricity and refrigeration.
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Recent research developments in polymer heat exchangers – A review

TL;DR: In this article, the development of polymer heat exchangers in the last decade, including cutting edge materials characteristics, heat transfer enhancement methods of polymer materials and a wide range of polymeric heat exchanger applications are reviewed and compared with literature.
Book

Process Intensification: Engineering for Efficiency, Sustainability and Flexibility

TL;DR: Process intensification is a chemical and process design approach that leads to substantially smaller, cleaner, safer, and more energy efficient process technology It improves process flexibility, product quality, speed to market and inherent safety, with a reduced environmental footprint as mentioned in this paper.