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Duane R. Romer

Researcher at Dow Chemical Company

Publications -  56
Citations -  368

Duane R. Romer is an academic researcher from Dow Chemical Company. The author has contributed to research in topics: Alkyl & Curing (chemistry). The author has an hindex of 8, co-authored 56 publications receiving 350 citations. Previous affiliations of Duane R. Romer include Dow AgroSciences.

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Polyphenylene oligomers and polymers

TL;DR: An oligomer, uncured polymer or cured polymer comprising the reaction product of one or more polyfunctional compounds containing two or more cyclopentadienone groups and at least one polyfunctional compound containing two OR more aromatic acetylene groups is defined in this article.
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Synthesis of 2,3‐dichloroquinoxalines via Vilsmeier reagent chlorination

TL;DR: In this paper, a high-yielding synthesis of 2,3-dichloroquinoxalines from 2, 3-dihydroxyquinoxaline derivatives is described.
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Development of potential manufacturing routes for substituted thiophenes – Preparation of halogenated 2-thiophenecarboxylic acid derivatives as building blocks for a new family of 2,6-dihaloaryl 1,2,4-triazole insecticides

TL;DR: The successful development of efficient synthetic routes to the halogenated thiophene building blocks paved the way for the development of viable commercial processes for XR-693 andXR-906, members of a new class of 2,6-dihaloaryl 1,2,4-triazole insecticides that exhibit selective activity against aphids, mites, and whiteflies coupled with low mammalian toxicity.
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Development of Manufacturing Processes for a New Family of 2,6-Dihaloaryl 1,2,4-Triazole Insecticides

TL;DR: In this paper, the process development work for the new 2,6-dihaloaryl-1,2,4-triazole insecticide 1, and the development of a one-pot process toward a potential commercial manufacturing process are presented.
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Backbone Degradable Poly(aryl acetal) Photoresist Polymers: Synthesis, Acid Sensitivity, and Extreme Ultraviolet Lithography Performance

TL;DR: A new class of acid labile poly(aryl acetal) polymers has been developed that can be used in photoresist formulations for next-generation microlithography techniques including extreme ultraviolet (EUV) or electron beam lithography as discussed by the authors.