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Paul H. Townsend

Researcher at Dow Chemical Company

Publications -  41
Citations -  1550

Paul H. Townsend is an academic researcher from Dow Chemical Company. The author has contributed to research in topics: Benzocyclobutene & Dielectric. The author has an hindex of 14, co-authored 41 publications receiving 1508 citations.

Papers
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Journal ArticleDOI

Development of a Low‐Dielectric‐Constant Polymer for the Fabrication of Integrated Circuit Interconnect

TL;DR: SiLK resin this article is a solution of a low-molecular-weight aromatic thermosetting polymer, which is used in the fabrication of interconnect structures such as the one shown in the Figure.
Journal ArticleDOI

Benzocyclobutene (BCB) dielectrics for the fabrication of high density, thin film multichip modules

TL;DR: In this article, a new class of organic dielectrics, benzocyclobutenes, are described and their application to the fabrication of thin-film multichip modules is detailed.
Journal ArticleDOI

Kinetics of copper drift in low-/spl kappa/ polymer interlevel dielectrics

TL;DR: In this paper, the drift of copper ions in various low-permittivity (low-spl kappa/) polymer dielectrics to identify copper barrier requirements for reliable interconnect integration in future ULSI was addressed.
Journal ArticleDOI

Benzocyclobutene (DVS-BCB) polymer as an interlayer dielectric (ILD) material

TL;DR: In this paper, the DVS-BCB (CYCLOTENETM 5021) material is used to fill 0.20 μm gaps at 5:1 aspect ratios.
Patent

Composition containing a cross-linkable matrix precursor and a poragen, and a porous matrix prepared therefrom

TL;DR: A suitable cross-linkable matrix precursor and a poragen can be treated to form a porous cross-linked matrix having a Tg of greater than 300 °C, making the porous matrix material particularly attractive for a variety of electronic applications including integrated circuits, multichip modules and flat panel display devices as discussed by the authors.