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Frank Greer

Researcher at California Institute of Technology

Publications -  43
Citations -  1163

Frank Greer is an academic researcher from California Institute of Technology. The author has contributed to research in topics: Atomic layer deposition & Thin film. The author has an hindex of 15, co-authored 43 publications receiving 1039 citations. Previous affiliations of Frank Greer include Jet Propulsion Laboratory.

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Fabrication and deformation of three-dimensional hollow ceramic nanostructures

TL;DR: The fabrication of hollow ceramic scaffolds that mimic the length scales and hierarchy of biological materials are reported, suggesting that the hierarchical design principles offered by hard biological organisms can be applied to create damage-tolerant lightweight engineering materials.
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Silicon Detector Arrays with Absolute Quantum Efficiency over 50% in the Far Ultraviolet for Single Photon Counting Applications

TL;DR: By combining the precision control of MBE and ALD, this work has demonstrated more than 50% external QE in the far and near ultraviolet in megapixel arrays and demonstrated that other important device performance parameters such as dark current are unchanged after these processes.

Higher Compressive Strengths and Bauschinger Effect in Conformally-Passivated Copper Nanopillars.

TL;DR: In this paper, the authors demonstrate that atomic layer deposition of conformal 5-25 nm thick TiO_2/Al_(2)O_3 coatings onto electroplated single crystalline copper pillars with diameters ranging from 75 nm to 1 μm generally inhibits the ability of a dislocation to vanish at the free surface.
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Toward total automation of microfluidics for extraterrestial in situ analysis.

TL;DR: To the authors' knowledge, this is the first demonstration of completely automated end-to-end μCE analyses on a single, fully integrated microfluidic device.
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Higher compressive strengths and the Bauschinger effect in conformally passivated copper nanopillars

TL;DR: In this article, the authors demonstrate that atomic layer deposition of conformal 5-25 nm thick TiO_2/Al_(2)O_3 coatings onto electroplated single crystalline copper pillars with diameters ranging from 75 nm to 1 μm generally inhibits the ability of a dislocation to vanish at the free surface.