scispace - formally typeset
H

Hendrik F. Hamann

Researcher at IBM

Publications -  272
Citations -  9468

Hendrik F. Hamann is an academic researcher from IBM. The author has contributed to research in topics: Data center & Airflow. The author has an hindex of 43, co-authored 267 publications receiving 8848 citations. Previous affiliations of Hendrik F. Hamann include National Institute of Standards and Technology & GlobalFoundries.

Papers
More filters
Patent

Forecasting power from renewable energy sources

TL;DR: In this article, a computer-implemented method for managing and forecasting power from at least one renewable energy source is provided, where a list of tasks to be performed within a given timeframe is created, wherein a power load is associated with performing each of the tasks.
Proceedings ArticleDOI

Pairs (Re)Loaded: System Design & Benchmarking For Scalable Geospatial Applications

TL;DR: This paper benchmarks a previously introduced big data platform that enables the analysis of big data from remote sensing and other geospatial-temporal data, called IBM PAIRS Geoscope, developed by leveraging open source big data technologies (Hadoop/HBase) that are in principle scalable in storage and compute to hundreds of PetaBytes.
Proceedings ArticleDOI

Satellite Guided Mobile Wireless Methane Detection for Oil and Gas Operations

TL;DR: This work proposes mobile methane sensing using satellite guidance as an alternative that bridges the current gap in that it can provide near term feedback at a low cost per well.
Proceedings ArticleDOI

A Numerical Technique for the Approximation of Thermal Zones

TL;DR: In this article, the problem of identifying thermal zones is formulated as a boundary value problem for convective transport and solved using a numerical method capable of solving convection-dominated problems accurately leads to identification of the zones by a simple postprocessing of the numerical solution of the boundary value problems.
Proceedings ArticleDOI

Spatial Frequency Domain Analysis of Heat Transfer in Microelectronic Chips With Applications to Temperature Aware Computing

TL;DR: In this paper, the authors present an analytical approach for obtaining the thermal transfer function of multi-layer chips in the spatial frequency domain, which is used to address a number of key issues such as the appropriate power granularity required for microarchitecture thermal-power analysis, and the impact of packaging and cooling solutions on heat removal from chip hotspots.