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Theodore G. Van Kessel

Researcher at IBM

Publications -  136
Citations -  1559

Theodore G. Van Kessel is an academic researcher from IBM. The author has contributed to research in topics: Heat sink & Layer (electronics). The author has an hindex of 20, co-authored 134 publications receiving 1507 citations. Previous affiliations of Theodore G. Van Kessel include Agency for Science, Technology and Research & King Abdulaziz City for Science and Technology.

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Patent

Method for controlling a line dimension arising in photolithographic processes

TL;DR: In this article, the authors proposed a method for controlling a line dimension in a photolithographic process utilizing a wafer coated with a chemically amplified photoresist, which comprises the steps of measuring at at least two times, and from at least three angles, evolving signals comprising intensities of light diffracted from a portion of an exposed patterned area on the waver.
Patent

Method and apparatus for chip cooling

TL;DR: In this article, an inlet for receiving a fluid, a manifold comprising a plurality of apertures formed therein for decreasing the pressure of the fluid from a first pressure by adiabatic expansion, was presented.
Patent

Techniques for Data Center Cooling

TL;DR: In this paper, a computer equipment rack is provided comprising one or more air inlets, one or several exhaust outlets, and an air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment Rack and a length that is less than a length of the Computer Equipment Rack.
Patent

Inexpensive interferometric eye tracking system

TL;DR: In this paper, an inexpensive eye tracking system using the interference fringes between the corneal glint and the red eye retinal reflection to obtain an angularly resolved, background-immune eye point signal for use as a pointing device for personal computers.
Patent

Heterogeneous thermal interface for cooling

TL;DR: In this article, a thermal interface for coupling a heat source to a heat sink is presented, where a mesh and a liquid are adapted to contact both the heat source and the heat sink when disposed there.