Recent progress in electronic skin or e-skin research is broadly reviewed, focusing on technologies needed in three main applications: skin-attachable electronics, robotics, and prosthetics. First, since e-skin will be exposed to prolonged stresses of various kinds and needs to be conformally adhered to irregularly shaped surfaces, materials with intrinsic stretchability and self-healing properties are of great importance. Second, tactile sensing capability such as the detection of pressure, strain, slip, force vector, and temperature are important for health monitoring in skin attachable devices, and to enable object manipulation and detection of surrounding environment for robotics and prosthetics. For skin attachable devices, chemical and electrophysiological sensing and wireless signal communication are of high significance to fully gauge the state of health of users and to ensure user comfort. For robotics and prosthetics, large-area integration on 3D surfaces in a facile and scalable manner is critical. Furthermore, new signal processing strategies using neuromorphic devices are needed to efficiently process tactile information in a parallel and low power manner. For prosthetics, neural interfacing electrodes are of high importance. These topics are discussed, focusing on progress, current challenges, and future prospects.

https://onlinelibrary.wiley.com/doi/pdf/10.1002/adma.201904765

Electronic Skin: Recent Progress and Future Prospects for Skin‐Attachable Devices for Health Monitoring, Robotics, and Prosthetics

The performance and integration density of silicon integrated circuits (ICs) have progressed at an unprecedented pace in the past 60 years. While silicon ICs thrive at low-power high-performance computing, creating flexible and large-area electronics using silicon remains a challenge. On the other hand, flexible and printed electronics use intrinsically flexible materials and printing techniques to manufacture compliant and large-area electronics. Nonetheless, flexible electronics are not as efficient as silicon ICs for computation and signal communication. Flexible hybrid electronics (FHE) leverages the strengths of these two dissimilar technologies. It uses flexible and printed electronics where flexibility and scalability are required, i.e., for sensing and actuating, and silicon ICs for computation and communication purposes. Combining flexible electronics and silicon ICs yields a very powerful and versatile technology with a vast range of applications. Here, the fundamental building blocks of an FHE system, printed sensors and circuits, thinned silicon ICs, printed antennas, printed energy harvesting and storage modules, and printed displays, are discussed. Emerging application areas of FHE in wearable health, structural health, industrial, environmental, and agricultural sensing are reviewed. Overall, the recent progress, fabrication, application, and challenges, and an outlook, related to FHE are presented.

A New Frontier of Printed Electronics: Flexible Hybrid Electronics.

Recently, self-healing hydrogel bioelectronic devices have raised enormous interest for their tissue-like mechanical compliance, desirable biocompatibility, and tunable adhesiveness on bioartificial organs. However, the practical applications of these hydrogel-based sensors are generally limited by their poor fulfillment of stretchability and sensitivity, brittleness under subzero temperature, and single sensory function. Inspired by the fiber-reinforced microstructures and mechano-transduction systems of human muscles, a self-healing (90.8%), long-lasting thermal tolerant and dual-sensory hydrogel-based sensor is proposed, with high gauge factor (18.28) within broad strain range (268.9%), low limit of detection (5% strain), satisfactory thermosensation (-0.016 °C-1), and highly discernible temperature resolution (2.7 °C). Especially by introducing a glycerol/water binary solvent system, desirable subzero-temperature self-healing performance, high water-retaining, and durable adhesion feature can be achieved, resulting from the ice crystallization inhibition and highly dynamic bonding. On account of the advantageous mechanoreception and thermosensitive capacities, a flexible touch keyboard for signature identification and a "fever indicator" for human forehead's temperature detection can be realized by this hydrogel bioelectronic device.

Muscle-Inspired Self-Healing Hydrogels for Strain and Temperature Sensor.

Scientific Reports 5: Article number: 984610.1038/srep09846; published online: April202015; updated: October052015

/pdf/corrigendum-sound-packing-dna-packing-open-circular-dna-with-m2obn702z4.pdf

Corrigendum: Sound Packing DNA: packing open circular DNA with low-intensity ultrasound

Skin is the largest organ, with the functionalities of protection, regulation, and sensation. The emulation of human skin via flexible and stretchable electronics gives rise to electronic skin (e-skin), which has realized artificial sensation and other functions that cannot be achieved by conventional electronics. To date, tremendous progress has been made in data acquisition and transmission for e-skin systems, while the implementation of perception within systems, that is, sensory data processing, is still in its infancy. Integrating the perception functionality into a flexible and stretchable sensing system, namely artificial skin perception, is critical to endow current e-skin systems with higher intelligence. Here, recent progress in the design and fabrication of artificial skin perception devices and systems is summarized, and challenges and prospects are discussed. The strategies for implementing artificial skin perception utilize either conventional silicon-based circuits or novel flexible computing devices such as memristive devices and synaptic transistors, which enable artificial skin to surpass human skin, with a distributed, low-latency, and energy-efficient information-processing ability. In future, artificial skin perception would be a new enabling technology to construct next-generation intelligent electronic devices and systems for advanced applications, such as robotic surgery, rehabilitation, and prosthetics.

Artificial Skin Perception.

Highly Sensitive Temperature Sensor: Ligand‐Treated Ag Nanocrystal Thin Films on PDMS with Thermal Expansion Strategy

Multiaxial and Transparent Strain Sensors Based on Synergetically Reinforced and Orthogonally Cracked Hetero-Nanocrystal Solids

The popularity of colloidal quantum dot (CQD) solar cells has increased owing to their tunable bandgap, multiple exciton generation, and low-cost solution processes. ZnO nanoparticle (NP) layers are generally employed as electron transport layers in CQD solar cells to efficiently extract the electrons. However, trap sites and the unfavorable band structure of the as-synthesized ZnO NPs have hindered their potential performance. Herein, we introduce a facile method of ZnO NP annealing in the colloidal state. Electrical, structural, and optical analyses demonstrated that the colloidal-annealing of ZnO NPs effectively passivated the defects and simultaneously shifted their band diagram; therefore, colloidal-annealing is a more favorable method as compared to conventional film-annealing. These CQD solar cells based on colloidal-annealed ZnO NPs exhibited efficient charge extraction, reduced recombination and achieved an enhanced power conversion efficiency (PCE) of 9.29%, whereas the CQD solar cells based on ZnO NPs without annealing had a PCE of 8.05%. Moreover, the CQD solar cells using colloidal-annealed ZnO NPs exhibited an improved air stability with 98% retention after 120 days, as compared to that of CQD solar cells using non-annealed ZnO NPs with 84% retention.

Colloidal-annealing of ZnO nanoparticles to passivate traps and improve charge extraction in colloidal quantum dot solar cells

Controllable doping and passivation of ZnO thin films by surface chemistry modification to design low-cost and high-performance thin film transistors

We report a simple, solution-based, and postsynthetic process for simultaneous ligand exchange, surface passivation, and doping of CdSe nanocrystals (NCs) for the design of high-performance field-e...

Designing High-Performance CdSe Nanocrystal Thin-Film Transistors Based on Solution Process of Simultaneous Ligand Exchange, Trap Passivation, and Doping

Ho Kun Woo

Papers

Highly Sensitive Temperature Sensor: Ligand‐Treated Ag Nanocrystal Thin Films on PDMS with Thermal Expansion Strategy

Multiaxial and Transparent Strain Sensors Based on Synergetically Reinforced and Orthogonally Cracked Hetero-Nanocrystal Solids

Colloidal-annealing of ZnO nanoparticles to passivate traps and improve charge extraction in colloidal quantum dot solar cells

Controllable doping and passivation of ZnO thin films by surface chemistry modification to design low-cost and high-performance thin film transistors

Designing High-Performance CdSe Nanocrystal Thin-Film Transistors Based on Solution Process of Simultaneous Ligand Exchange, Trap Passivation, and Doping