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James A. Lacey

Researcher at IBM

Publications -  61
Citations -  2139

James A. Lacey is an academic researcher from IBM. The author has contributed to research in topics: Layer (electronics) & Liquid crystal. The author has an hindex of 22, co-authored 61 publications receiving 2061 citations.

Papers
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Atomic-beam alignment of inorganic materials for liquid-crystal displays

TL;DR: A non-contact alignment process, which uses low-energy ion beams impinging at a glancing angle on amorphous inorganic films, such as diamond-like carbon, is reported, and it is found that displays of higher quality and reliability could be made at a lower cost than the rubbing technique.
Journal ArticleDOI

Liquid crystal alignment on carbonaceous surfaces with orientational order.

TL;DR: This work uses near-edge x-ray absorption fine structure (NEXAFS) spectroscopy to link the orientational bond order at three carbonaceous surfaces with the direction of liquid crystal (LC) alignment on these surfaces, showing that LC alignment can be created on any carbonaceous substrate by inducing orientational order at its surface.
Journal ArticleDOI

Hotspot-Limited Microprocessors: Direct Temperature and Power Distribution Measurements

TL;DR: The SIMP method, which is applied to the dual core PowerPC970MP to directly measure the temperature and power fields as a function of workload and frequency, is applied and a pronounced movement of the hotspot location is observed.
PatentDOI

Atomic beam alignment of liquid crystals

TL;DR: In this article, it was shown that liquid crystals can be aligned on a polyimide surface exposed to a low energy and neutral Argon ion beam, and the angle of incidence over which alignment was measured was between 10 and 20 degrees.
Patent

Thermal measurments of electronic devices during operation

TL;DR: In this paper, a system and method for measuring thermal distributions of an electronic device during operation is disclosed. The system includes an electronic devices, a heat sink adjacent to the electronic device and an electrical-insulating layer disposed on the electronic devices so as to separate the electronics and the heat sink.