Minhua Lu

TL;DR: A non-contact alignment process, which uses low-energy ion beams impinging at a glancing angle on amorphous inorganic films, such as diamond-like carbon, is reported, and it is found that displays of higher quality and reliability could be made at a lower cost than the rubbing technique.

TL;DR: In this article, a 300mm wafer-level three-dimensional integration (3DI) process using tungsten (W) through-silicon vias and hybrid Cu/adhesive wafer bonding is demonstrated.

TL;DR: In this paper, an ion beam is used to bomb a substrate with an ionbeam at a designated incident angle to simultaneously deposit the film onto the substrate and arrange an atomic structure of the film in at least one predetermined aligned direction.

TL;DR: In this article, the surface is bombarded with ions and quenched with a reactive component to saturate dangling bonds on the surface, and a reactive gas is introduced to the ion beam to saturation the dangling bonds.

TL;DR: In this article, the surface is bombarded with ions and quenched with a reactive component to saturate dangling bonds on the surface, and a reactive gas is introduced to the ion beam to saturation the dangling bonds.