J
Jongsung Kim
Researcher at University of California, Irvine
Publications - 10
Citations - 158
Jongsung Kim is an academic researcher from University of California, Irvine. The author has contributed to research in topics: Electroplating & Soldering. The author has an hindex of 7, co-authored 10 publications receiving 155 citations.
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Fluxless wafer bonding with Sn-rich Sn-Au dual-layer structure
Jongsung Kim,Chin C. Lee +1 more
TL;DR: In this article, the authors report the initial result of bonding two 2-in. silicon wafers using Sn-rich Sn-Au dual-layer structure that is produced by electroplating process.
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Fluxless Flip-Chip Solder Joint Fabrication Using Electroplated Sn-Rich Sn–Au Structures
TL;DR: A fluxless flip-chip bonding process in hydrogen environment using newly developed Sn-rich Sn-Au electroplated multilayer solder bumps is presented in this article, where Cr/Au dual layer is employed as the plating seed layer and the underbump metallurgy (UBM) is explained in some details.
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Fluxless Sn–Ag bonding in vacuum using electroplated layers
Jongsung Kim,Chin C. Lee +1 more
TL;DR: In this article, a fluxless bonding process in vacuum environment using newly developed electroplated Sn-Ag multilayer structure at eutectic composition is presented, in which the oxygen content is reduced by a factor of 7600 comparing to air, to inhibit solder oxidation.
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Nucleation and growth of intermetallics and gold clusters on thick tin layers in electroplating process
TL;DR: In this article, the growth mechanism of Au layer on top of Sn layer is diffusion-controlled process and the primal Au-Sn intermetallic compound and Au phases are AuSn4(2.1) and Au(1.1), respectively.
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Very High-Temperature Joints Between Si and Ag–Copper Substrate Made at Low Temperature Using InAg System
TL;DR: In this paper, a fluxless bonding process between silicon and Ag-copper dual-layer substrate using electroplated indium/silver solder is presented, which can be applied to mounting numerous high-power silicon devices to Cu substrates for various industrial applications.