FXT is a software tool which implements inductive fault analysis for CMOS circuits. It extracts a comprehensive list of circuit-level faults for any given CMOS circuit and ranks them according to their relative likelihood of occurrence. Five commercial CMOS circuits are analyzed using FXT. Of the extracted faults, approximately 50% can be modeled by single-line stuck-at 0/1 fault model. Faults extracted from two circuits are simulated with the switch-level fault simulator FMOSSIM. The test set provided by the circuits' manufacturer, which detects 100% of the single-line stuck-at 0/1 faults, detected between 73% and 89% of the simulated faults.<<ETX>>

Extraction and Simulation of Realistic CMOS Faults using

This paper describes the new cell-aware test (CAT) approach, which enables a transistor-level and defect-based ATPG on full CMOS-based designs to significantly reduce the defect rate of manufactured ICs, including FinFET technologies. We present results from a defect-oriented CAT fault model generation for 1,940 standard library cells, as well as the application of CAT to several industrial designs. We present high volume production test results from a 32 nm notebook processor and from a 350 nm automotive design, including the achieved defect rate reduction in defective-parts-per-million. We also present CAT diagnosis and physical failure analysis results from one failing part and give an outlook for using the functionality for quickly ramping up the yield in advanced technology nodes.

Cell-Aware Test

System-on-Chip (SoC) complexity and the increasing costs of silicon motivate the breaking of an SoC into smaller "chiplets." A chiplet-based SoC design process has the promise to enable fast SoC construction by using advanced packaging technologies to tightly integrate multiple disparate chips (e.g., CPU, GPU, memory, FPGA). However, when assembling chiplets into a single SoC, correctness validation becomes a significant challenge. In particular, the network-on-chip (NoC) used within the individual chiplets and across chiplets to tie them together can easily have deadlocks, especially if each chip is designed in isolation. We introduce a simple, modular, yet elegant methodology for ensuring deadlock-free routing in multi-chiplet systems. As an example, we focus on future systems combining chiplets on an active silicon interposer. To maximize modularity, each individual chiplet is free to implement its own NoC topology and local routing algorithm, and the interposer can implement its own independent topology and routing. Our methodology imposes a few simple turn restrictions applied only to traffic as it flows into or out of the chiplets from the interposer, and we provide a way to determine these restrictions. The end result is an overall approach that enables highly-modular, chiplet-based SoC construction while eliminating deadlocks with high performance.

Modular routing design for chiplet-based systems

Insertion of scan chains is the most common technique to ensure observability and controllability of sequential elements in an IC. However, when the chip deals with secret information, the scan chain can be used as back door for accessing secret (or hidden) information, and thus jeopardize the overall security. Several scan-based attacks on cryptographic functions have been described and showed the need for secure scan implementations. These attacks assume a single scan chain. However the conception of large designs and restrictions in terms of test costs may require the implementation of many scan chains and additional test infrastructures for test response compaction. In this paper, we present a new generic scan attack that covers a wide range of industrial test infrastructures, including spatial response compressors.

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New security threats against chips containing scan chain structures

This paper describes a new approach for significantly improving overall defect coverage for CMOS-based designs. We present results from a defect-oriented cell-aware (CA) library characterization and pattern-generation flow and its application to 1,900 cells of a 32-nm technology. The CA flow enabled us to detect cell-internal bridges and opens that caused static, gross-delay, and small-delay defects. We present highvolume production test results from a 32-nm notebook processor to which CA test patterns were applied, including the defect rate reduction in PPM that was achieved after testing 800,000 parts. We also present cell-internal diagnosis and physical failure analysis results from one failing part.

Cell-aware Production test results from a 32-nm notebook processor

Due to the rapidly growing size of integrated circuits, there is a need for new algorithms for automatic test pattern generation (ATPG). While classical algorithms reach their limit, there have been recent advances in algorithms to solve Boolean Satisfiability (SAT). Because Boolean SAT solvers are working on conjunctive normal forms (CNFs), the problem has to be transformed. During transformation, relevant information about the problem might get lost and, therefore, is not available in the solving process. In this paper, we present a technique that applies structural knowledge about the circuit during the transformation. As a result, the size of the problem instances decreases, as well as the run time of the ATPG process. The technique was implemented, and experimental results are presented. The approach was combined with the ATPG framework of NXP Semiconductors. It is shown that the overall performance of an industrial framework can significantly be improved. Further experiments show the benefits with regard to the efficiency and robustness of the combined approach.

On Acceleration of SAT-Based ATPG for Industrial Designs

Industry is facing increasingly tougher quality requirements for more complex ICs. To meet these quality requirements we need to improve the defect coverage. This paper presents a new methodology to significantly increase the defect coverage of the test patterns generated by ATPG tools. The fault model used during the ATPG is enhanced to directly target layout-based intra-cell faults. In contrast to previous techniques, such as Gate-Exhaustive, N-Detect, or Embedded-Multi-Detect, which either are too complex for real-world designs or merely improve the probability of detecting intra-cell defects, the new approach targets the actual root causes of intra-cell defects. The newly proposed Cell-Aware-methodology has been evaluated for 90nm and 65nm technologies on 1671 library cells and on 10 real industrial designs with up to 50 million faults. The experimental results show an average increase of 1.2% in defect coverage and a reduction of 420ppm in escape rate for a 50mm2 design.

Juergen Schloeffel

Papers

Cell-Aware Test

On Acceleration of SAT-Based ATPG for Industrial Designs

Defect-oriented cell-aware ATPG and fault simulation for industrial cell libraries and designs

Short Papers On Acceleration of SAT-Based ATPG for Industrial Designs

Cell-aware Production test results from a 32-nm notebook processor