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Junmo Kim

Researcher at KAIST

Publications -  7
Citations -  143

Junmo Kim is an academic researcher from KAIST. The author has contributed to research in topics: Thin film & Layer (electronics). The author has an hindex of 3, co-authored 7 publications receiving 55 citations.

Papers
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Journal ArticleDOI

A soft and transparent contact lens for the wireless quantitative monitoring of intraocular pressure.

TL;DR: In this paper, a soft and transparent contact lens for the quantitative monitoring of intraocular pressure (IOP) in real time using a smartphone was proposed, and tested in humans and rabbits.
Journal ArticleDOI

Comparative study of residual stresses measurement methods on CVD diamond films

Junmo Kim, +1 more
- 11 Aug 1998 - 
TL;DR: In this article, the authors grow diamond films on the p-type Si (100) substrate under CH{sub 4}/H{sub 2} gas mixture using the hot filament chemical vapor deposition (HFCVD) method, and subsequently measured residual stresses in air at various stages of film growth using the three methods aforementioned.
Journal ArticleDOI

Multi-directionally wrinkle-able textile OLEDs for clothing-type displays

TL;DR: In this article, the authors demonstrate a textile display that can endure the active movements of a human body, and an elastomeric strain buffer for reducing mechanical stress is also inserted into the textile platform.
Journal ArticleDOI

Evaluating mechanical properties of 100nm-thick atomic layer deposited Al2O3 as a free-standing film

TL;DR: In this article, tensile tests on free-standing alumina thin films floating on water were conducted to measure their mechanical properties, and the results indicated that higher Young's modulus and the strength were obtained from thin films formed at higher deposition temperatures.
Proceedings ArticleDOI

Effects of the Materials Properties of Epoxy Molding Films (EMFs) on Fan-Out Packages (FOPs) Characteristics

TL;DR: In this article, the warpage of Epoxy Molding Films (EMFs) was measured using 3D - Digital Image Correlation (3D-DIC) method, and the effects of process conditions on the WARpage of EMFs were also evaluated.