K
Kin-tak Lau
Researcher at Swinburne University of Technology
Publications - 264
Citations - 15646
Kin-tak Lau is an academic researcher from Swinburne University of Technology. The author has contributed to research in topics: Epoxy & Ultimate tensile strength. The author has an hindex of 57, co-authored 260 publications receiving 12950 citations. Previous affiliations of Kin-tak Lau include Chonbuk National University & Asia University (Taiwan).
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Novel cobalt-doped molybdenum oxynitride quantum dot@N-doped carbon nanosheets with abundant oxygen vacancies for long-life rechargeable zinc–air batteries
Thanh Tuan Nguyen,Thanh Tuan Nguyen,Jayaraman Balamurugan,Kin-tak Lau,Nam Hoon Kim,Joong Hee Lee +5 more
TL;DR: In this article, a new type of oxygen vacancies enriched cobalt-doped molybdenum oxynitride quantum dot-anchored Ndoped carbon nanosheets (VO-CMON@NCNs) was demonstrated as an advanced air-cathode for long-life rechargeable ZABs.
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Enhancement on mechanical strength of adhesively-bonded composite lap joints at cryogenic environment using coiled carbon nanotubes
TL;DR: In this paper, the hardness, tensile and lap joint shear behaviors of pure epoxy, straight multi-walled carbon nanotube (MWNT)/epoxy and coiled multilayer carbon-nanotubes (CCNT/epoxy) adhesives conditioned at room temperature (RT) and cryogenic temperature (CT) were investigated.
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Tensile properties of a polymer-based adhesive at low temperature with different strain rates
TL;DR: In this paper, the tensile properties of a polymer-based adhesive subject to different strain rates at low temperature were investigated, and the results showed that the strength of adhesive increased remarkably with the increase of strain rate and decrease of temperature.
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Additive Manufacturing of Epoxy Resins: Materials, Methods, and Latest Trends
TL;DR: Epoxy resins are widely used in various applications including electronic materials, automobiles, adhesives and coatings, and fiber-reinforced composites because of their unique properties.
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Effect of Cu addition on phase transformation of Ti–Ni–Hf high-temperature shape memory alloys
TL;DR: In this paper, the effects of the addition of Cu on the phase transformation of Ti-Ni-Hf high-temperature shape memory alloy (SMA) have been studied and the experimental results shown that the Cu addition into the TiNiHf alloy slightly decreases the phase-transformation temperatures, results in that the peak in the DSC curves splits into two peaks during cooling after thermal cycling and separates the martensite→R phase and R phase→parent phase transitions with the Cu content of 5 at%.