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Kun Wang

Researcher at Oak Ridge National Laboratory

Publications -  28
Citations -  533

Kun Wang is an academic researcher from Oak Ridge National Laboratory. The author has contributed to research in topics: Grain boundary & Microstructure. The author has an hindex of 11, co-authored 23 publications receiving 397 citations. Previous affiliations of Kun Wang include Alfred University & Chinese Academy of Sciences.

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Morphologies of tungsten nanotendrils grown under helium exposure.

TL;DR: It is speculated that the strong tendency to high-angle grain boundaries in the low-energy tendrils implies that as the tendrils twist or bend, strain must accumulate until nucleation of a grain boundary is favorable compared to further lattice rotation.
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Transmutation-induced precipitation in tungsten irradiated with a mixed energy neutron spectrum

TL;DR: In this article, a tentative roadmap of the process of transmutation-induced precipitation in tungsten is presented characterizing the defect features (i.e., W-Re-Os clusters and precipitates) consisting of transmutant elements and radiation defects.
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Effect of starting microstructure on helium plasma-materials interaction in tungsten

TL;DR: In this paper, the authors have exposed hot-worked and recrystallized tungsten to an 80eV helium ion beam at a temperature of 900 ˚C to fluences of 2 ǫ −1023 or 20 Þ−1023 He/m2.
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Microwave sintering of W/Cu functionally graded materials

TL;DR: In this article, a microwave sintering method was used to produce five-layered W/Cu functionally graded materials (FGM) with fine microstructure and good properties in the development of fusion reactors as well as spallation neutron sources.
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Plasma source development for fusion-relevant material testing

TL;DR: The material plasma exposure experiment (MPEX) is a newly proposed steady state linear plasma device designed to deliver the necessary plasma heat flux to a target for testing, including the capability to expose a priori neutron-damaged material samples to those plasmas as discussed by the authors.