L
Lauren Boteler
Researcher at United States Army Research Laboratory
Publications - 38
Citations - 412
Lauren Boteler is an academic researcher from United States Army Research Laboratory. The author has contributed to research in topics: Heat sink & Thermal resistance. The author has an hindex of 9, co-authored 38 publications receiving 271 citations. Previous affiliations of Lauren Boteler include University of Maryland, College Park & United States Department of the Army.
Papers
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Journal ArticleDOI
Numerical investigation and sensitivity analysis of manifold microchannel coolers
TL;DR: In this paper, a numerical investigation of a single-phase manifold microchannel cooler (MMC) heat exchanger demonstrating a reduction in fluid pressure drop while improving chip-temperature uniformity is presented.
Journal ArticleDOI
Experimental evaluation of metallic phase change materials for thermal transient mitigation
David Gonzalez-Nino,David Gonzalez-Nino,Lauren Boteler,Dimeji Ibitayo,Nicholas R. Jankowski,Damian Urciuoli,Iain Kierzewski,Pedro O. Quintero +7 more
TL;DR: In this article, the performance of phase change materials (PCMs) for high-power 19-ms pulses was investigated and two commercially available organic PCMs and a dielectric gel (Sylgard 527®) were used for comparison.
Journal ArticleDOI
A System to Package Perspective on Transient Thermal Management of Electronics
H. Peter J. de Bock,David Huitink,Patrick J. Shamberger,James Spencer Lundh,Sukwon Choi,Nicholas Niedbalski,Lauren Boteler +6 more
TL;DR: In this article, the authors provide an overview of the types of transients to consider, from the transients that occur during switching at the chip surface all the way to the system-level transients which transfer heat to air.
Proceedings ArticleDOI
Stacked power module with integrated thermal management
TL;DR: In this article, the authors proposed a co-designed approach to eliminate single function components such as wirebonds and heat sinks whose sole purpose is electrical conduction or heat removal, respectively, and replace them with MFCs.
Proceedings ArticleDOI
Stacked DBC Cavitied Substrate for a 15-kV Half-bridge Power Module
TL;DR: In this article, the authors present a solution to utilize direct-bonded-copper (DBC), which is a conventional low-voltage power module substrate, for highvoltage (15 kV) half-bridge power module packaging.