H. Peter J. de Bock

TL;DR: In this article, the authors provide an overview of the types of transients to consider, from the transients that occur during switching at the chip surface all the way to the system-level transients which transfer heat to air.

TL;DR: In this article, the flow performance of a novel thin form-factor cooling solution, the advanced dual piezoelectric cooling jet (DCJ), is evaluated, coupled with a thermal performance analysis using an experiment simulating thin profile consumer electronics.

TL;DR: In this paper, the authors investigate experimental methods of testing capillary performance of wick structures ranging from micro-to nano-scales and facilitate a pathway to the development of nano-engineered wick structure for high performance heat pipes.

TL;DR: In this paper, the authors describe the need for and design of a charging station to accurately dispense the working fluid and a thermal characterization experiment to characterize performance, including detailed analysis of accuracy and validation of the setup.

TL;DR: In this paper, the effects of pore size and gravitational force on the flow-related properties of the wick structures of a heat pipe were investigated. But, the pore sizes were not considered.