THE DESIGN AND ANALYSIS OF EXPERIMENTS. By Oscar Kempthorne. New York, John Wiley and Sons, Inc., 1952. 631 pp. $8.50. This book by a teacher of statistics (as well as a consultant for \"experimenters\") is a comprehensive study of the philosophical background for the statistical design of experiment. It is necessary to have some facility with algebraic notation and manipulation to be able to use the volume intelligently. The problems are presented from the theoretical point of view, without such practical examples as would be helpful for those not acquainted with mathematics. The mathematical justification for the techniques is given. As a somewhat advanced treatment of the design and analysis of experiments, this volume will be interesting and helpful for many who approach statistics theoretically as well as practically. With emphasis on the \"why,\" and with description given broadly, the author relates the subject matter to the general theory of statistics and to the general problem of experimental inference. MARGARET J. ROBERTSON

The Design and Analysis of Experiments

Probability, Reliability and Statistical Methods in Engineering Design

流体力学用語集 非線形音響学(Nonlinear acoustics)

Flexible electronics incorporate all the functional attributes of conventional rigid electronics in formats that have been altered to survive mechanical deformations. Understanding the evolution of device performance during bending, stretching, or other mechanical cycling is, therefore, fundamental to research efforts in this area. Here, we review the various classes of flexible electronic devices (including power sources, sensors, circuits and individual components) and describe the basic principles of device mechanics. We then review techniques to characterize the deformation tolerance and durability of these flexible devices, and we catalogue and geometric designs that are intended to optimize electronic systems for maximum flexibility.

Flexible electronics under strain: a review of mechanical characterization and durability enhancement strategies

https://lup.lub.lu.se/search/ws/files/4174259/3567231.pdf

Review on modeling development for multiscale chemical reactions coupled transport phenomena in solid oxide fuel cells

A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending

Optimal parameter selection is a crucial step in improving the quality of electronic packaging processes. Traditional approaches usually start with a set of physical experiments and then employ Design of Experiment (DOE) based response surface methodology (RSM) to find the parameter settings that will optimize a desired system response. Nowadays deterministic computer simulations such as Finite Element Analysis (FEA) are often used to replace physical experiments when evaluating a system response, e.g., the stress level in an electronic packaging. However, FEA simulations are usually computationally expensive due to their inherent complexity. In order to find the optimal parameters, it is not practical to use FEA simulations to calculate system responses over a large number of parameter combinations. Nor will it be effective to blindly use DOE-based response surface methodology to analyze the deterministic FEA outputs. In this paper, we will utilize a spatial statistical method (i.e., the Kriging model) for analyzing deterministic FEA outputs from an electronic packaging process. We suggest a sequential method when using the Kriging model to search for the optimal parameter values that minimize the stress level in the electronic packaging. Compared with the traditional RSM, our sequential parameter selection method entertains several advantages: it can remarkably reduce the total number of FEA simulations required for optimization, it makes the optimal solution insensitive to the choice of the initial simulation setting, and it can also depict the response surface and the associated uncertainty over the entire parameter space.

Optimal Parameter Selection for Electronic Packaging Using Sequential Computer Simulations

The response surface method has been widely used in practical engineering design optimization problems, where the optimal searches are based on the response surfaces mimicking the physical processes or models Sometimes the response surface method is the only practical option to be able to perform design optimization, such as simulation-based design optimization when the simulations are usually computationally expensive In conventional approaches, the response surfaces are usually built up using a group of sampling points based on certain design of experiment schemes The accuracy of the response surface depends largely on the number of sampling points and their distributions in the design space, as well as the approximation functions for the response surface Currently there is no general method that could achieve the necessary accuracy of a response surface with the minimal expensive (or the number of sampling points) In this paper, a novel sequential response surface updating approach is proposed to improve the efficiency and the accuracy of simulation-based optimizations for electronic packages It is a dynamic and adaptive approach, which starts with a small number of initial sampling points based on Halton sequence (also called quasi Monte Carlo method), and then refines the response surface by adding more sampling points during the optimization process This method is demonstrated with a design optimization problem of the thermo-mechanical analyses of a ceramic chip carrier assembly A simplified thermo-mechanical model is used to perform the interfacial stress analysis of the solder bounding The objective of is to minimize the interfacial stress by changing the bonding compliance in the specified design space The case study indicates that, comparing with the conventional direct methods, this approach could greatly improve the computational efficiency of optimization processes with the needed accuracy for simulation-based design optimization

A novel response surface method for design optimization of electronic packages

The geometry of the solder ball is one of several factors which have significant effects on the reliability of interconnects of electronic packages. Intensive studies of the thermo-mechanical reliability of BGA packages with different solder balls have been reported in recent years. Only a few studies of the geometric shape effect on the reliability of solder joints under drop loading conditions could be found in the literature. Because of the different failure modes and failure mechanisms, the geometric shape effects on the reliability of solder joints could be very different under thermo-mechanical loading condition and drop loading condition. In this paper, the effects of the solder ball geometry on the reliability under drop loading conditions are systematically studied with numerical simulations. The solder ball shape is predicted by using the Surface Evolver software. The solder ball geometry is parameterized with solder volume, diameter, height, and pad size. The variation of stresses on the solder joint/pad interface with solder volume and pad diameter is obtained from numerical simulations. The effect of the solder ball geometric parameters on the drop damage is discussed.

Numerical studies of the mechanical response of solder joint to drop/impact load

Flexible display module reliability were investigated herein with experiments, such as bending, twisting and ball drop. The pretests of all the three experiments were carried out firstly to primarily understand the flexibility and mechanical behavior of the display. Based on the pretest results, the corresponding fatigue test setup method and process were put forward. Then, the fatigue tests were executed. At last, through the failure analysis, the flexibility and reliability of the flexible display in different use cases were evaluated. Suggestions about how to use the display and improve the reliability through change the design were given also.

Leon Xu

Papers

A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending

Optimal Parameter Selection for Electronic Packaging Using Sequential Computer Simulations

A novel response surface method for design optimization of electronic packages

Numerical studies of the mechanical response of solder joint to drop/impact load

Reliability study of flexible display module by experiments