THE DESIGN AND ANALYSIS OF EXPERIMENTS. By Oscar Kempthorne. New York, John Wiley and Sons, Inc., 1952. 631 pp. $8.50. This book by a teacher of statistics (as well as a consultant for \"experimenters\") is a comprehensive study of the philosophical background for the statistical design of experiment. It is necessary to have some facility with algebraic notation and manipulation to be able to use the volume intelligently. The problems are presented from the theoretical point of view, without such practical examples as would be helpful for those not acquainted with mathematics. The mathematical justification for the techniques is given. As a somewhat advanced treatment of the design and analysis of experiments, this volume will be interesting and helpful for many who approach statistics theoretically as well as practically. With emphasis on the \"why,\" and with description given broadly, the author relates the subject matter to the general theory of statistics and to the general problem of experimental inference. MARGARET J. ROBERTSON

The Design and Analysis of Experiments

Lead-free soldering has emerged as one of the key technologies for assembling in environmental-conscious electronics. Among several candidate alloys, the Sn–Ag–Cu alloy family is believed to be the first choice with the combination of other alloys such as Sn–Zn–Bi, Sn–Cu and Sn–Bi–Ag. Phase diagrams of lead-free alloy systems have been intensively examined by using careful thermal and microstructural analysis combined with the thermodynamic calculation such as the CLAPHAD method. The Cu6Sn5/Cu3Sn layers are formed at most lead-free solder alloy/Cu interfaces, while Cu–Zn compound layers are formed in the Sn–Zn/Cu system. Growth kinetics of intermetallic layers both in solid-state and in soldering are also discussed. Creep and fatigue phenomena are also reviewed. In many aspects of lead-free soldering, much more work is required to establish a sound scientific basis to promote their applications.

Advances in lead-free electronics soldering

Probability, Reliability and Statistical Methods in Engineering Design

https://lup.lub.lu.se/search/ws/files/4174259/3567231.pdf

Review on modeling development for multiscale chemical reactions coupled transport phenomena in solid oxide fuel cells

다중물리 해석 프로그램 : COMSOL Multiphysics

Three SnAgCu solder alloys (Sn2AgO.5Cu, Sn3.4AgO.8Cu, Sn4AgO.5Cu) have been tested to determine their deformation behavior in the temperature range 23-110/spl deg/C, strain-rates varying 10/sup -7/-10/sup -1/ 1/s. It is shown by optical micro-graphs of CSP solder joints that microstructure of SnAgCu may undergo through significant changes due to various loading conditions, which can occur during usage of microelectronic devices, such as thermal cycling, mechanical bending, and drop impact. The solidification microstructure consists typically of very large Sn-matrix colonies, with eutectic structure and intermetallic particles distributed within the colonies in cellular form. Typical observed temperature- and deformation-induced microstructural evolution includes recrystallization and twinning. The deformation mechanisms of the alloys have been predicted based on the values of measured activation energies and stress exponents. The constant stress and constant strain-rate tests have been performed in the shear configuration, which enables a stress-state of nearly pure shear in the solder joint. In the intermediate stress regime, the deformation appears to occur by the slip mechanism, and the rate is likely to be controlled by the dislocation climb process. The measured shear stress-strain data are utilized to determine the constants for the visco-plastic Anand's constitutive model.

Deformation characteristics and microstructural evolution of SnAgCu solder joints

Tensile and creep tests were conducted to characterize the deformation behavior of four dilute SnBi alloys: SnBi0.5 at. pct, SnBi1.5 at. pct, SnBi3 at. pct, and SnBi6 at. pct, the last two being supersaturated solid solutions at room temperature. The test temperatures were − 20 °C, 23 °C, 90 °C, and 150 °C, and the strain rates ranged from approximately 10−8 to 10−1 1/s. In the tensile tests, all the alloys showed strain-hardening behavior up to room temperature. At higher temperatures, only the higher-Bi-content alloys exhibited strain softening. The deformation behavior of the alloys can be divided into two stress regimes, and the change from the low-stress regime to the high-stress regime occurred at around 6 × 10−4<σ/E<7.5 × 10−4. The results suggest that, at the low-stress regime, the rate-controlling deformation mechanism changes from dislocation climb to viscous glide with the increasing Bi content of the alloy. At the high-stress regime, the activation energy of deformation is about equal in all the alloys (∼60 kJ/mol) and the stress exponents are high (10<n<12.5). Unlike in the other alloys, bismuth precipitated at room temperature from the solution-annealed and quenched SnBi6 at. pct alloy by the discontinuous mechanism. This strongly affects the mechanical properties and makes the alloy brittle at lower test temperatures. A comparison of the deformation behavior of the dilute SnBi alloys to that of the eutectic SnBi alloy suggests that the deformation of eutectic structure is controlled by the Sn-rich phase containing the equilibrium amount of dissolved Bi.

T. Reinikainen

Papers

Deformation characteristics and microstructural evolution of SnAgCu solder joints

Deformation behavior of dilute SnBi(0.5 to 6 at. pct) solid solutions

Fatigue of Chip Scale Package Interconnects Due to Cyclic Bending

Guidelines to select underfills for flip chip on board assemblies and compliant interposers for chip scale package assemblies

A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending