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Handbook Of Modern Sensors Physics Designs And Applications

3D Printing of Multilayered and Multimaterial Electronics: A Review

Colloidal nanoparticles have been widely studied and proven to have unique and superior properties compared to their bulk form and are attractive building blocks for diverse technologies, including energy conversion and storage, sensing, electronics, etc. However, transforming colloidal nanoparticles into functional devices while translating their unique properties from the nanoscale to the macroscale remains a major challenge. The development of advanced manufacturing methodologies that can convert functional nanomaterials into high-performance devices in a scalable, controllable and affordable manner presents great research opportunities and challenges for the next several decades. One promising approach to fabricate functional devices from nanoscale building blocks is additive manufacturing, such as 2D and 3D printing, owing to their capability of fast prototyping and versatile fabrication. Here, we review recent progress and methodologies for printing functional devices using colloidal nanoparticle inks with an emphasis on 2D nanomaterial-based inks. This review provides a comprehensive overview on four important and interconnected topics, including nanoparticle synthesis, ink formulation, printing methods, and device applications. New research opportunities as well as future directions are also discussed.

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Colloidal nanoparticle inks for printing functional devices: emerging trends and future prospects

The paper presents progress in infrared (IR) detector technologies during 200 history of their development. Classification of two types of IR detectors (photon detectors and thermal detectors) is done on the basis of their principle of operation. The overview of IR systems and detectors is presented. Also recent progress in different IR technologies is described. Discussion is focused mainly on current and the most rapidly developing detectors: HgCdTe heterostructure photodiodes, quantum well AlGaAs/GaAs photoresistors, and thermal detectors. The outlook for near-future trends in IR technologies is also presented.

Infrared detectors: an overview

Inkjet printing technology uses the low-cost direct deposition manufacturing technique for printing and is applicable in various fields including optics, ceramics, three-dimensional printing in biomedicine, and conductive circuitry. This study reviews the classifications and applications of inkjet printing technologies, with a focus on recent publications. The different design approaches, applications, and research progress of several inkjet printing techniques are reviewed. Among them, the piezoelectric inkjet printing technology is the main focus owing to its reliability and handling of a diverse range of inks. A piezo-driven inkjet printhead is activated by applying a voltage waveform to a piezoelectric membrane. The waveform ensures the formation of the designed droplet and a stable jet. A survey of various driving-voltage waveforms is conducted, which can serve as a reference to the research community that uses piezo-driven inkjet printheads. The challenges of printing quality, stability, and speed and their solutions as published in recent studies are reviewed. Technologies for producing high-viscosity inkjets are explored, and the applications of inkjet printing technology in textile, displays, and wearable devices are discussed.

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Classifications and Applications of Inkjet Printing Technology: A Review

https://iopscience.iop.org/article/10.1088/2058-8585/ab0cea/pdf

Inkjet printing and characterisation of a resistive temperature sensor on paper substrate

With the growing significance of printed sensors on the electronics market, new demands on quality and reproducibility have arisen. While most printing processes on standard substrates (e.g., Polyethylene terephthalate (PET)) are well-defined, the printing on substrates with rather porous, fibrous and rough surfaces (e.g., uncoated paper) contains new challenges. Especially in the case of inkjet-printing and other deposition techniques that require low-viscous nanoparticle inks the solvents and deposition materials might be absorbed, inhibiting the formation of homogeneous conductive layers. As part of this work, the sheet resistance of sintered inkjet-printed conductive silver (Ag-) nanoparticle cross structures on two different, commercially available, uncoated paper substrates using Van-der-Pauw's method is evaluated. The results are compared to the conductivity of well-studied, white heat stabilised and treated PET foil. While the sheet resistance on PET substrate is highly reproducible and the variations are solely process-dependent, the sheet resistance on uncoated paper depends more on the substrate properties themselves. The results indicate that the achievable conductivity as well as the reproducibility decrease with increasing substrate porosity and fibrousness.

https://www.mdpi.com/1424-8220/20/8/2398/pdf

Evaluation of the Sheet Resistance of Inkjet-Printed Ag-Layers on Flexible, Uncoated Paper Substrates Using Van-der-Pauw’s Method

The detection of infrared radiation is of great interest for a wide range of applications, such as absorption sensing in the infrared spectral range. In this work, we present a CMOS compatible pyroelectric detector which was devised as a mid-infrared detector, comprising aluminium nitride (AlN) as the pyroelectric material and fabricated using semiconductor mass fabrication processes. To ensure thermal decoupling of the detector, the detectors are realized on a Si3N4/SiO2 membrane. The detectors have been tested at a wavelength close to the CO2 absorption region in the mid-infrared. Devices with various detector and membrane sizes were fabricated and the influence of these dimensions on the performance was investigated. The noise equivalent power of the first demonstrator devices connected to a readout circuit was measured to be as low as 5 . 3 × 10 - 9 W / Hz .

A cmos compatible pyroelectric mid-infrared detector based on aluminium nitride

In a unique approach to develop a “green” solution for in-situ monitoring, low-cost inkjet-printed temperature sensors on paper substrate were fully integrated into natural fiber-reinforced lightweight components for which structural health monitoring is becoming increasingly important. The results showed that the sensors remained functional after the vacuum infusion process; furthermore, the integration of the sensors improved the mechanical integrity and stability of the lightweight parts, as demonstrated by tensile testing. To verify the qualification of the printed sensors for the target application, the samples were exposed to varying temperature and humidity conditions inside of a climate chamber. The sensors showed linear temperature dependence in the temperature range of interest (−20 to 60 °C) with a TCR ranging from 1.576 × 10−3 K−1 to 1.713 × 10−3 K−1. Furthermore, the results from the tests in humid environments indicated that the used paper-based sensors could be made almost insensitive to changes in ambient humidity by embedding them into fiber-reinforced lightweight materials. This study demonstrates the feasibility of fully integrating paper-based printed sensors into lightweight components, which paves the way towards integration of other highly relevant sensing devices, such as strain and humidity sensors, for structural health monitoring of smart, sustainable, and environmentally compatible lightweight composite materials.

https://www.mdpi.com/2227-9040/9/5/95/pdf

Low-Cost Inkjet-Printed Temperature Sensors on Paper Substrate for the Integration into Natural Fiber-Reinforced Lightweight Components

Fan-out wafer-level packaging (FOWLP) is an interesting platform for Microelectromechanical systems (MEMS) sensor packaging. Employing FOWLP for MEMS sensor packaging has some unique challenges, while some originate merely from the fabrication of redistribution layers (RDL). For instance, it is crucial to protect the delicate structures and fragile membranes during RDL formation. Thus, additive manufacturing (AM) for RDL formation seems to be an auspicious approach, as those challenges are conquered by principle. In this study, by exploiting the benefits of AM, RDLs for fan-out packaging of capacitive micromachined ultrasound transducers (CMUT) were realized via drop-on-demand inkjet printing technology. The long-term reliability of the printed tracks was assessed via temperature cycling tests. The effects of multilayering and implementation of an insulating ramp on the reliability of the conductive tracks were identified. Packaging-induced stresses on CMUT dies were further investigated via laser-Doppler velocimetry (LDV) measurements and the corresponding resonance frequency shift. Conclusively, the bottlenecks of the inkjet-printed RDLs for FOWLP were discussed in detail.

https://www.mdpi.com/2072-666X/11/6/564/pdf

On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers.

Lukas Rauter

Papers

Inkjet printing and characterisation of a resistive temperature sensor on paper substrate

Evaluation of the Sheet Resistance of Inkjet-Printed Ag-Layers on Flexible, Uncoated Paper Substrates Using Van-der-Pauw’s Method

A cmos compatible pyroelectric mid-infrared detector based on aluminium nitride

Low-Cost Inkjet-Printed Temperature Sensors on Paper Substrate for the Integration into Natural Fiber-Reinforced Lightweight Components

On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers.