This paper reviews the fundamentals and latest progress of modeling, analysis, and design technologies for signal integrity and electromagnetic compatibility on PCB and package in the past decades. Most results in this field are based on the very rich and highly educational literature produced by Prof. C. Paul in his long scientific career. The inclusion of parameters variability effects is also considered, and it is demonstrated how statistical simulations can become affordable by means of recently-introduced stochastic methods. Finally, the necessity of practical training of designers is mentioned, and an experience relying on realistic PCB demonstrators is illustrated.

Overview of Signal Integrity and EMC Design Technologies on PCB: Fundamentals and Latest Progress

Spread spectrum is a technique introduced for mitigating electromagnetic interference (EMI) problems in many class of circuits. In this paper, with particular emphasis on switching DC/DC converters, we consider the most common and most efficient known spreading techniques, looking for spreading parameters that ensure the highest EMI reduction and the lowest performance reduction in the circuit where the spreading is applied. The result is an interesting tradeoff not only between EMI reduction and performance drop, but also on the EMI reduction itself when considering different EMI victim models. The proposed analysis is supported by measurements on two switching DC/DC converters: 1) based on pulse-width modulation and 2) based on the resonant converter class.

EMI Reduction via Spread Spectrum in DC/DC Converters: State of the Art, Optimization, and Tradeoffs

Common-mode currents induced on cables attached to printed circuit boards (PCBs) can be a significant source of unintentional radiated emissions. This paper develops a model for estimating the amount of common-mode cable current that can be induced by the signal voltage on microstrip trace structures or heatsinks on a PCB. The model employs static electric field solvers or closed-form expressions to estimate the effective self-capacitances of the board, trace, and/or heatsink. These capacitances are then used to determine the amplitude of an equivalent common-mode voltage source that drives the attached cables. The model shows that these voltage-driven common-mode cable currents are relatively independent of the cable parameters and the trace or heatsink location when the PCB is small relative to the cable length and to a wavelength.

https://scholarsmine.mst.edu/cgi/viewcontent.cgi?article=2139&context=ele_comeng_facwork

Model for estimating radiated emissions from a printed circuit board with attached cables due to Voltage-driven sources

Two unique materials were developed, like graphene oxide (GO) sheets covalently grafted on to barium titanate (BT) nanoparticles and cobalt nanowires (Co-NWs), to attenuate the electromagnetic (EM) radiations in poly(vinylidene fluoride) (PVDF)-based composites. The rationale behind using either a ferroelectric or a ferromagnetic material in combination with intrinsically conducting nanoparticles (multiwall carbon nanotubes, CNTs), is to induce both electrical and magnetic dipoles in the system. Two key properties, namely, enhanced dielectric constant and magnetic permeability, were determined. PVDF/BT–GO composites exhibited higher dielectric constant compared to PVDF/BT and PVDF/GO composites. Co-NWs, which were synthesized by electrodeposition, exhibited saturation magnetization (Ms) of 40 emu/g and coercivity (Hc) of 300 G. Three phase hybrid composites were prepared by mixing CNTs with either BT–GO or Co-NWs in PVDF by solution blending. These nanoparticles showed high electrical conductivity and sig...

Poly(vinylidene fluoride)-based flexible and lightweight materials for attenuating microwave radiations.

Parasitic inductance in printed circuit board (PCB) geometries can detrimentally impact the electromagnetic interference (EMI) performance and signal integrity of high-speed digital designs. This paper identifies and quantifies the parameters that affect the inductance of some typical PCB geometries. Closed-form expressions are provided for estimating the inductances of simple trace and ground plane configurations.

/pdf/quantifying-emi-resulting-from-finite-impedance-reference-3u7dderqdd.pdf

Quantifying EMI resulting from finite-impedance reference planes

Fundamental EMI source mechanisms leading to common-mode radiation from printed circuit boards with attached cables are presented in this paper. Two primary EMI source mechanisms have been identified: one associated with a differential-mode voltage and another associated with a differential-mode current, both of which result in a common-mode current on an attached cable. These mechanisms can he used to relate printed circuit layout geometries to EMI sources. The two mechanisms are demonstrated through numerical and experimental results, and an example from a production printed-circuit design is presented.

/pdf/investigation-of-fundamental-emi-source-mechanisms-driving-2v86hmhn28.pdf

M.J. Wilhelm

Papers

Investigation of fundamental EMI source mechanisms driving common-mode radiation from printed circuit boards with attached cables