J
James L. Drewniak
Researcher at Missouri University of Science and Technology
Publications - 441
Citations - 6699
James L. Drewniak is an academic researcher from Missouri University of Science and Technology. The author has contributed to research in topics: Printed circuit board & Electromagnetic interference. The author has an hindex of 39, co-authored 433 publications receiving 6141 citations. Previous affiliations of James L. Drewniak include University of Minnesota & Intel.
Papers
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Investigation of fundamental EMI source mechanisms driving common-mode radiation from printed circuit boards with attached cables
TL;DR: In this paper, two EMI source mechanisms have been identified: one associated with a differential-mode voltage and another associated with differential mode current, both of which result in a common-mode current on an attached cable.
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Power bus decoupling on multilayer printed circuit boards
TL;DR: In this article, a decoupling strategy for multilayer boards must account for the low inductance and relatively high capacitance of the power bus, which is not appropriate for one-sided or two-sided printed circuit boards.
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EMI from cavity modes of shielding enclosures-FDTD modeling and measurements
TL;DR: In this paper, the FDTD model was used to investigate the EMI from a test enclosure with slots and apertures excited by interior sources in a rectangular test enclosure, and the results indicated that radiation at cavity mode resonances through slots and aperture modes of nonresonant dimensions can be as significant as radiation at aperture or slot resonances.
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Electromagnetic interference (EMI) of system-on-package (SOP)
TL;DR: In this paper, the authors discuss the design and development of system-on-package (SOP) integrated high-performance digital LSIs and for radio frequency (RF) and analog circuits.
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Quantifying SMT decoupling capacitor placement in dc power-bus design for multilayer PCBs
Jun Fan,James L. Drewniak,James L. Knighten,N.W. Smith,Antonio Orlandi,T.P. Van Doren,Todd H. Hubing,Richard E. DuBroff +7 more
TL;DR: In this article, the authors investigated the effect of placing SMT capacitors in proximity to ICs in multilayer PCB designs and demonstrated that local decoupling can provide high-frequency benefits for certain PCB geometries through mutual inductive coupling between closely spaced vias.