M
Margaret Ziomek-Moroz
Researcher at United States Department of Energy
Publications - 92
Citations - 629
Margaret Ziomek-Moroz is an academic researcher from United States Department of Energy. The author has contributed to research in topics: Corrosion & Electrochemical noise. The author has an hindex of 10, co-authored 92 publications receiving 474 citations.
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Corrosion Sensors for Structural Health Monitoring of Oil and Natural Gas Infrastructure: A Review
TL;DR: Conventional corrosion sensors and emerging sensor technologies are reviewed in terms of sensing principles, sensor designs, advantages, and limitations, and challenges including durability and stability in extreme and harsh conditions such as high temperature high pressure in subsurface wellbores are discussed.
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Effect of Molybdenum on the Corrosion Behavior of High-Entropy Alloys CoCrFeNi2 and CoCrFeNi2Mo0.25 under Sodium Chloride Aqueous Conditions
Alvaro A. Rodriguez,Joseph Tylczak,Michael C. Gao,Paul D. Jablonski,Martin Detrois,Margaret Ziomek-Moroz,Jeffrey A. Hawk +6 more
TL;DR: In this paper, the corrosion behavior of high-entropy alloys (HEAs) CoCrFeNi2 and CoCr FeNi2Mo0.25 was investigated in 3.5 wt. percent sodium chloride (NaCl) at 25°C by electrochemical methods.
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Effect of HCO3− on electrochemical kinetics of carbon steel corrosion in CO2-saturated brines
Ruishu F. Wright,Ruishu F. Wright,Edward R. Brand,Margaret Ziomek-Moroz,Joseph Tylczak,Paul R. Ohodnicki,Paul R. Ohodnicki +6 more
TL;DR: In this article, the effect of HCO3−(aq) on CO2 corrosion of carbon steel was investigated in deaerated 3.5wt% NaCl solutions at 30 °C from pH 3.96 to 7.15.
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Effects of cathodic protection on corrosive wear of 304 stainless steel
TL;DR: In this article, the authors demonstrated that cathodic protection under potentiostatic condition was beneficial under low wearing force but it became ineffective under higher wearing forces or more negative cathodic potentials.
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An overview of corrosion–wear interaction for planarizing metallic thin films
TL;DR: In this article, the role of corrosion, wear, and their synergistic effect in chemical-mechanical planarization (CMP) of metallic thin films for manufacturing semiconductor devices such as computer chips is discussed.