scispace - formally typeset
M

Mark A. Tschopp

Researcher at United States Army Research Laboratory

Publications -  143
Citations -  5998

Mark A. Tschopp is an academic researcher from United States Army Research Laboratory. The author has contributed to research in topics: Grain boundary & Dislocation. The author has an hindex of 38, co-authored 143 publications receiving 4737 citations. Previous affiliations of Mark A. Tschopp include Air Force Research Laboratory & Mines ParisTech.

Papers
More filters
Journal ArticleDOI

Molecular dynamics simulations of deformation mechanisms of amorphous polyethylene

TL;DR: In this article, molecular dynamics simulations were used to study deformation mechanisms during uniaxial tensile deformation of an amorphous polyethylene polymer, and the energy contributions from the united atom potential were calculated as a function of strain to help elucidate the inherent deformation mechanism within the elastic, yield, and strain hardening regions.
Journal ArticleDOI

Probing grain boundary sink strength at the nanoscale: Energetics and length scales of vacancy and interstitial absorption by grain boundaries in α -Fe

TL;DR: In this article, the effect of grain boundary energy and disorientation angle on the boundary sink strength was explored; the strongest correlation occurred between the grain boundary energies and the mean point defect formation energies.
Journal ArticleDOI

Asymmetric tilt grain boundary structure and energy in copper and aluminium

TL;DR: In this paper, the energy of asymmetric tilt grain boundaries in Cu and Al was investigated using atomistic simulations, and the authors found that asymmetric boundaries with low index normals do not necessarily have lower energies than boundaries with similar inclination angles.
Journal ArticleDOI

Structures and energies of Σ 3 asymmetric tilt grain boundaries in copper and aluminium

TL;DR: In this paper, a nonlinear conjugate gradient algorithm was employed along with an embedded atom method potential for Cu and Al to generate the equilibrium 0'K grain boundary structures.
Journal ArticleDOI

Tensile strength of 〈1 0 0〉 and 〈1 1 0〉 tilt bicrystal copper interfaces

TL;DR: In this paper, a simple model was proposed to illustrate the impact of interfacial porosity and stresses acting on the slipplane in non-glide directions on tensile interface strength.