M
Mark D. Jaffe
Researcher at IBM
Publications - 99
Citations - 1864
Mark D. Jaffe is an academic researcher from IBM. The author has contributed to research in topics: Layer (electronics) & Image sensor. The author has an hindex of 24, co-authored 99 publications receiving 1847 citations. Previous affiliations of Mark D. Jaffe include GlobalFoundries.
Papers
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Patent
Double-sided integrated circuit chips
Kerry Bernstein,Timothy J. Dalton,Jeffrey P. Gambino,Mark D. Jaffe,Paul D. Kartschoke,Stephen E. Luce,Anthony K. Stamper +6 more
TL;DR: A double-sided integrated circuit (DIN) as discussed by the authors is a type of integrated circuit where the backside silicon is removed from two silicon-on-insulator (SiOI) wafers and the contacts are formed in the upper wafer to devices in the lower wafer and wiring levels are formed on the upper Wafer.
Patent
A damascene copper wiring image sensor
TL;DR: In this paper, a single etch is conducted to completely remove the interlevel dielectric and barrier layers that traverse the optical path, and the etched opening is then refilled with a layer of either reflective or absorptive material.
Patent
Transistor structure with thick recessed source/drain structures and fabrication process of same
Andres Bryant,Mark D. Jaffe +1 more
TL;DR: In this paper, an improved transistor structure that decreases source/drain resistance without increasing gate-to-S/D capacitance, thereby increasing device operation, is proposed, where the S/D structures are formed into recesses formed on a semiconductor wafer through a semiconducting layer and a first layer of a buried insulator having at least two layers.
Patent
CMOS imager array with recessed dielectric
James W. Adkisson,Jeffrey P. Gambino,Zhong-Xiang He,Mark D. Jaffe,Robert K. Leidy,Stephen E. Luce,Richard J. Rassel,Edmund J. Sprogis +7 more
TL;DR: In this article, a microlens array having microlenses and color filters formed above the interlevel dielectric material layer, a micro-ens and respective color filter in alignment with a respective light receiving structure formed at a surface of the substrate.
Journal ArticleDOI
The evolution of IBM CMOS DRAM technology
Eric Adler,John K. DeBrosse,Stephen Frank Geissler,Steven J. Holmes,Mark D. Jaffe,Jeffrey B. Johnson,C. W. Koburger,Jerome B. Lasky,B. F. Lloyd,Glen L. Miles,James S. Nakos,Wendell P. Noble,Steven H. Voldman,Michael D. Armacost,Richard A. Ferguson +14 more