Part I: Background and Fundamentals Introduction, Mohamed Gad-el-Hak, University of Notre Dame Scaling of Micromechanical Devices, William Trimmer, Standard MEMS, Inc., and Robert H. Stroud, Aerospace Corporation Mechanical Properties of MEMS Materials, William N. Sharpe, Jr., Johns Hopkins University Flow Physics, Mohamed Gad-el-Hak, University of Notre Dame Integrated Simulation for MEMS: Coupling Flow-Structure-Thermal-Electrical Domains, Robert M. Kirby and George Em Karniadakis, Brown University, and Oleg Mikulchenko and Kartikeya Mayaram, Oregon State University Liquid Flows in Microchannels, Kendra V. Sharp and Ronald J. Adrian, University of Illinois at Urbana-Champaign, Juan G. Santiago and Joshua I. Molho, Stanford University Burnett Simulations of Flows in Microdevices, Ramesh K. Agarwal and Keon-Young Yun, Wichita State University Molecular-Based Microfluidic Simulation Models, Ali Beskok, Texas A&M University Lubrication in MEMS, Kenneth S. Breuer, Brown University Physics of Thin Liquid Films, Alexander Oron, Technion, Israel Bubble/Drop Transport in Microchannels, Hsueh-Chia Chang, University of Notre Dame Fundamentals of Control Theory, Bill Goodwine, University of Notre Dame Model-Based Flow Control for Distributed Architectures, Thomas R. Bewley, University of California, San Diego Soft Computing in Control, Mihir Sen and Bill Goodwine, University of Notre Dame Part II: Design and Fabrication Materials for Microelectromechanical Systems Christian A. Zorman and Mehran Mehregany, Case Western Reserve University MEMS Fabrication, Marc J. Madou, Nanogen, Inc. LIGA and Other Replication Techniques, Marc J. Madou, Nanogen, Inc. X-Ray-Based Fabrication, Todd Christenson, Sandia National Laboratories Electrochemical Fabrication (EFAB), Adam L. Cohen, MEMGen Corporation Fabrication and Characterization of Single-Crystal Silicon Carbide MEMS, Robert S. Okojie, NASA Glenn Research Center Deep Reactive Ion Etching for Bulk Micromachining of Silicon Carbide, Glenn M. Beheim, NASA Glenn Research Center Microfabricated Chemical Sensors for Aerospace Applications, Gary W. Hunter, NASA Glenn Research Center, Chung-Chiun Liu, Case Western Reserve University, and Darby B. Makel, Makel Engineering, Inc. Packaging of Harsh-Environment MEMS Devices, Liang-Yu Chen and Jih-Fen Lei, NASA Glenn Research Center Part III: Applications of MEMS Inertial Sensors, Paul L. Bergstrom, Michigan Technological University, and Gary G. Li, OMM, Inc. Micromachined Pressure Sensors, Jae-Sung Park, Chester Wilson, and Yogesh B. Gianchandani, University of Wisconsin-Madison Sensors and Actuators for Turbulent Flows. Lennart Loefdahl, Chalmers University of Technology, and Mohamed Gad-el-Hak, University of Notre Dame Surface-Micromachined Mechanisms, Andrew D. Oliver and David W. Plummer, Sandia National Laboratories Microrobotics Thorbjoern Ebefors and Goeran Stemme, Royal Institute of Technology, Sweden Microscale Vacuum Pumps, E. Phillip Muntz, University of Southern California, and Stephen E. Vargo, SiWave, Inc. Microdroplet Generators. Fan-Gang Tseng, National Tsing Hua University, Taiwan Micro Heat Pipes and Micro Heat Spreaders, G. P. "Bud" Peterson, Rensselaer Polytechnic Institute Microchannel Heat Sinks, Yitshak Zohar, Hong Kong University of Science and Technology Flow Control, Mohamed Gad-el-Hak, University of Notre Dame) Part IV: The Future Reactive Control for Skin-Friction Reduction, Haecheon Choi, Seoul National University Towards MEMS Autonomous Control of Free-Shear Flows, Ahmed Naguib, Michigan State University Fabrication Technologies for Nanoelectromechanical Systems, Gary H. Bernstein, Holly V. Goodson, and Gregory L. Snider, University of Notre Dame Index

The MEMS Handbook

https://escholarship.org/content/qt8rf718jm/qt8rf718jm.pdf?t=krnesf

Recent Advances in Mechanical Micromachining

This paper provides a roadmap of development in the thermal and fabrication aspects of microchannels as applied in microelectronics and other high heat-flux cooling applications. Microchannels are defined as flow passages that have hydraulic diameters in the range of 10 to 200 micrometers. The impetus for microchannel research was provided by the pioneering work of Tuckerman and Pease [1] at Stanford University in the early eighties. Since that time, this technology has received considerable attention in microelectronics and other major application areas, such as fuel cell systems and advanced heat sink designs. After reviewing the advancement in heat transfer technology from a historical perspective, the advantages of using microchannels in high heat flux cooling applications is discussed, and research done on various aspects of microchannel heat exchanger performance is reviewed. Single-phase performance for liquids is still expected to be describable by conventional equations; however, the gas flow may...

Evolution of Microchannel Flow Passages-Thermohydraulic Performance and Fabrication Technology

3.2. Two-Photon Lithography (TPL) 919 4. Serial Writing with Charged Particles 920 4.1. Electron Beam Lithography 920 4.2. Ion Beam Lithography 920 4.3. Scanning Probe Resist Lithography 921 5. Microand Nanomachining 921 5.1. Focused Ion Beam 921 5.2. Scanning Probe Nanomachining 921 6. Direct Writing and Material Deposition 921 7. Moulding 922 7.1. Mould Fabrication 922 7.2. Demoulding: Mould Treatment 924 7.3. Embossing Thermoplastic Materials: Nanoimprint Lithography (NIL) 924

Fabrication approaches for generating complex micro- and nanopatterns on polymeric surfaces.

When collimated beams of low energy ions are used to bombard materials, the surface often develops a periodic pattern or “ripple” structure. Different types of patterns are observed to develop under different conditions, with characteristic features that depend on the substrate material, the ion beam parameters, and the processing conditions. Because the patterns develop spontaneously, without applying any external mask or template, their formation is the expression of a dynamic balance among fundamental surface kinetic processes, e.g., erosion of material from the surface, ion-induced defect creation, and defect-mediated evolution of the surface morphology. In recent years, a comprehensive picture of the different kinetic mechanisms that control the different types of patterns that form has begun to emerge. In this article, we provide a review of different mechanisms that have been proposed and how they fit together in terms of the kinetic regimes in which they dominate. These are grouped into regions of behavior dominated by the directionality of the ion beam, the crystallinity of the surface, the barriers to surface roughening, and nonlinear effects. In sections devoted to each type of behavior, we relate experimental observations of patterning in these regimes to predictions of continuum models and to computer simulations. A comparison between theory and experiment is used to highlight strengths and weaknesses in our understanding. We also discuss the patterning behavior that falls outside the scope of the current understanding and opportunities for advancement.

Making waves: Kinetic processes controlling surface evolution during low energy ion sputtering

At the macroscale, the milling process is very versatile and capable of creating three-dimensional features and structures. Adaptation of this process at the microscale could lead to the rapid and direct fabrication of micromolds and masks to aid in the development of microcomponents. This task has been undertaken, and results of the process indicate it can become an increasingly useful method. The micromilling process is characterized by milling tools that are currently in the range from 22-100 /spl mu/m in diameter and made by the focused-ion beam machining process. The tools are used in a specially designed, high-precision milling machine. Results are comparable to other processes currently used to fabricate mold and mask features. The micromilling process can create trench-like features with nearly vertical sidewalls and good smoothness. External corners are sharp and stepped features can be machined simply by programming those shapes. The process is direct, and therefore dimensional errors do not accumulate as can occur with serial fabrication processes.

Development of the micromilling process for high-aspect-ratio microstructures

This work combines focused ion beam sputtering and ultra-precision machining as a first step in fabricating metal alloy microcomponents. Micro-end mills having ∼25 μm diameters are made by sputtering cobalt M42 high-speed steel and C2 micrograin tungsten carbide tool blanks. A 20 keV focused gallium ion beam is used to define a number of cutting edges and tool end clearance. Cutting edge radii of curvature are less than or equal to 0.1 μm. Micro-end mill tools having 2, 4 and 5 cutting edges successfully machine millimeter long trenches in 6061-T4 aluminum, brass, 4340 steel and polymethyl methacrylate. Machined trench widths are approximately equal to the tool diameters, and surface roughnesses (Ra) at the bottom of micromachined features are ∼200 nm. Microtools are robust and operate for more than 6 h without fracture. Results from ultra-precision machining aluminum alloy at feed rates as high as 50 mm/minute and an axial depth of 1.0 μm are included.

/pdf/micromilling-of-metal-alloys-with-focused-ion-beam-18rl7rjf52.pdf

Micromilling of metal alloys with focused ion beam–fabricated tools

This paper presents techniques for fabricating microscopic, curvilinear features in a variety of workpiece materials. Micro-grooving and micro-threading tools having cutting widths as small as 13 {micro}m are made by focused ion beam sputtering and used for ultra-precision machining. Tool fabrication involves directing a 20 keV gallium beam at polished cylindrical punches made of cobalt M42 high-speed steel or C2 tungsten carbide to create a number of critically aligned facets. Sputtering produces rake facets of desired angle and cutting edges having radii of curvature equal to 0.4 {micro}m. Clearance for minimizing frictional drag of a tool results from a particular ion beam/target geometry that accounts for the sputter yield dependence on incidence angle. It is believed that geometrically specific cutting tools of this dimension have not been made previously. Numerically controlled, ultra-precision machining with micro-grooving tools results in a close match between tool width and feature size. Microtools are used to machine 13 {micro}m wide, 4 {micro}m deep, helical grooves in polymethyl methacrylate and 6061 Al cylindrical workplaces. Micro-grooving tools are also used to fabricate sinusoidal cross-section features in planar metal samples.

/pdf/microgrooving-and-microthreading-tools-for-fabricating-j44f434cbr.pdf

Microgrooving and microthreading tools for fabricating curvilinear features

Conventional milling techniques scaled to ultrasmall dimensions have been used to machine polymethyl methacrylate (PMMA) with micrometer-sized milling tools. The object of this work is to achieve machining of a common material over dimensions exceeding 1 mm while holding submicrometer tolerances and micrometer size features. Fabricating the milling tools themselves was also an object of the study. A tool geometry for nominal 25 micrometer diameter cutting tools was found that cuts PMMA with submicrometer tolerances over trench lengths of 2 mm. The tool shape is a simple planar facet cut by focused ion beam milling on ground and polished 25 micrometer diameter steel tool blanks. Pairs of trenches 24 micrometers wide, 26 micrometers deep, 2.3 mm long, with a 14 micrometer separation were milled under various machining conditions. The results indicate that the limits of the machining process in terms of speed, pattern complexity, and tolerances have not been approached. This is the first demonstration of a generic method for microtool making by focused ion beam machining combined with ultraprecision numerically controlled milling. The method is shown to be capable of producing structures and geometries that are considered inaccessible by conventional materials removal techniques, and generally regarded as applications for deep X-ray lithography.

Micrometer-scale machining: tool fabrication and initial results

A mathematical model of focused ion-beam milling is used to generate dwell times for the vector scanned pixel address scheme of a focused ion-beam deflection system. The model incorporates the absolute sputter yield of the solid as a function of the angle of incidence, and the relationship between the ion-beam current distribution and the pixel size of the deflection pattern. The object of this work is to be able to call for an arbitrary geometric shape to be ion milled and then have the numerical model compute the pixel dwell times for the deflection system such that the final cavity is sputtered. Experimental verification of the procedure was accomplished with parabolic troughs, hemispherical troughs, and cosine troughs. The term “trough” means a plane of symmetry in the ion-milled cavity. These same geometric shapes were also ion milled using a rotational axis of symmetry, yielding sinusoidal ring patterns, parabolic dishes, and hemispherical dishes. The absolute maximum depth for each of the cavities ...

Michael J. Vasile

Papers

Development of the micromilling process for high-aspect-ratio microstructures

Micromilling of metal alloys with focused ion beam–fabricated tools

Microgrooving and microthreading tools for fabricating curvilinear features

Micrometer-scale machining: tool fabrication and initial results

Depth control of focused ion-beam milling from a numerical model of the sputter process