Bulk and surface passivation by silicon nitride has become an indispensable element in industrial production of multicrystalline silicon (mc-Si) solar cells. Microwave PECVD is a very effective method for high-throughput deposition of silicon nitride layers with the required properties for bulk and surface passivation. In this paper an analysis is presented of the relation between deposition parameters of microwave PECVD and material properties of silicon nitride. By tuning the process conditions (substrate temperature, gas flows, working pressure) we have been able to fabricate silicon nitride layers which fulfill almost ideally the four major requirements for mc-Si solar cells: (1) good anti-reflection coating (refractive index tunable between 2·0 and 2·3); (2) good surface passivation on p-type FZ wafers (Seff<30 cm/s); (3) good bulk passivation (improvement of IQE at 1000 nm by 30% after short thermal anneal); (4) long-term stability (no observable degradation after several years of exposure to sunlight). By implementing this silicon nitride deposition in an inline production process of mc-Si solar cells we have been able to produce cells with an efficiency of 16·5%.



Finally, we established that the continuous deposition process could be maintained for at least 20 h without interruption for maintenance. On this timescale we did not observe any significant changes in layer properties or cell properties. This shows the robustness of microwave PECVD for industrial production. Copyright © 2005 John Wiley & Sons, Ltd.

Bulk and surface passivation of silicon solar cells accomplished by silicon nitride deposited on industrial scale by microwave PECVD

Through an advanced hydrogenation process that involves controlling and manipulating the hydrogen charge state, substantial increases in the bulk minority carrier lifetime are observed for standard commercial grade boron-doped Czochralski grown silicon wafers from 250-500 μs to 1.3-1.4 ms and from 8 to 550 μs on p-type Czochralski wafers grown from upgraded metallurgical grade silicon. However, the passivation is reversible, whereby the passivated defects can be reactivated during subsequent processes. With appropriate processing that involves controlling the charge state of hydrogen, the passivation can be retained on finished devices yielding independently confirmed voltages on cells fabricated using standard commercial grade boron-doped Czochralski grown silicon over 680 mV. Hence, it appears that the charge state of hydrogen plays an important role in determining the reactivity of the atomic hydrogen and, therefore, ability to passivate defects.

Advanced Bulk Defect Passivation for Silicon Solar Cells

Hydrogen Passivation of B-O Defects in Czochralski Silicon

Disclosed is a novel method for creating local contacts in solar cells. In the method, a surface passivation that has been applied to a semiconductor substrate is locally etched away using a plasma process with the help of a thin stretched, elastic foil. If necessary, deep doping gradients are then locally created at the same points by means of a hydrogen plasma treatment with the help of thermal donors so as to increase the diffusion length of the charge carriers in the direction of the contacts. Finally, local heterostructure contacts are applied through the same mask openings. The contacts are characterized by a much lower saturation current than common diffused contacts and are therefore particularly suitable for high-performance solar cells.

Local heterostructure contacts

Development of advanced hydrogenation processes for silicon solar cells via an improved understanding of the behaviour of hydrogen in silicon

The incorporation of hydrogen into standard p-type Czochralski (Cz) silicon (≥1 Ωcm) by a 110 MHz plasma treatment at 260°C leads to the formation of an n-type region due to hydrogen enhanced thermal donor (TD) formation in hydrogenated regions of the wafer, if a subsequent annealing in air is applied at 450°C. Spreading resistance probe (SRP) and light beam induced current (LBIC) measurements were used for the experimental analysis. The p-n junction depth, i. e. the counter doping by TDs, depends on the initial doping level of the p-type substrate, and therefore on the post-hydrogenation annealing time. The penetration of the n-type region into the wafer bulk is driven by a rapid hydrogen diffusion. The essential process for a TD generation is the creation of metastable hydrogen molecular species around 260°C and their decay at 450°C.

N. M. Kazuchits

Papers

A Two-Step Low-Temperature Process For A P-N Junction Formation Due To Hydrogen Enhanced Thermal Donor Formation In P-Type Czochralski Silicon