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Paul A. Colegrove

Researcher at Cranfield University

Publications -  96
Citations -  7348

Paul A. Colegrove is an academic researcher from Cranfield University. The author has contributed to research in topics: Welding & Residual stress. The author has an hindex of 37, co-authored 94 publications receiving 5489 citations. Previous affiliations of Paul A. Colegrove include University of Bedfordshire & University of Cambridge.

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Modelling distortion reduction on pre- and post-weld rolled gas metal arc weldedplates

TL;DR: In this paper, the authors demonstrate the preand post-weld rolling techniques for reducing weld distortion, which can be applied before fabrication, potentially by the steel manufacturer, and demonstrate that there was an average 38% reduction of distortion with this technique.

Additive manufacturing and obsolescence management in the defence context

TL;DR: In this article, the authors present a perspective paper on the role of additive manufacturing in obsolescence management, which includes four contributions from experts in different sectors, bringing different analytical approaches to the issue.
Journal ArticleDOI

The Effect of Pre-Weld Rolling on Distortion and Residual Stress in Fusion Welded Steel Plate

TL;DR: In this paper, the results of an initial trial are presented, and indicate that post-weld distortion can be reduced by an average of 38% when correct rolling parameters are used.
Journal ArticleDOI

Henry Granjon Prize Competition 2004 Winner, Category A “Joining and fabrication technology”

TL;DR: Trivex as discussed by the authors is a tool for friction stir welding of aluminium alloys, which was developed from 2-dimensional models and used in experiments on 7075-T7351 aluminium alloy.
Posted Content

The Effect of Thermal History on Microstructural Evolution, Cold-Work Refinement and {\alpha}/\b{eta} Growth in Ti-6Al-4V Wire + Arc AM

TL;DR: In this article, the microstructural changes in the heat affected zone (HAZ) could be related to the thermal cycle, and the white band in the microstructure corresponded to 825 C well below the beta-transus temperature and above this boundary the bi-modal substrate material was converted to lamellar.