P
Pushkaraj D. Sonawane
Researcher at Sathyabama University
Publications - 10
Citations - 76
Pushkaraj D. Sonawane is an academic researcher from Sathyabama University. The author has contributed to research in topics: Soldering & Solar energy. The author has an hindex of 4, co-authored 10 publications receiving 50 citations. Previous affiliations of Pushkaraj D. Sonawane include Massachusetts Institute of Technology.
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An overview of concentrated solar energy and its applications
TL;DR: In this paper, the authors present general descriptions, current projects and summary of the concentrated solar energy (CSE) technologies and present application areas show that CSE can be used in a wide variety of systems, could provide significant environmental and monetary benefits.
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Concentrated solar energy in materials processing
TL;DR: In this article, solar energy conversion can be performed in three different ways: solar fuels, solar electricity, and solar power generation, which is available in abundant in nature, is the least utilised.
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Microstructure, Mechanical, and Electrical Properties and Corrosion Analysis of Lead-Free Solder CSI Joints on Cu Substrate Using Novel Concentrated Solar Energy Soldering (CSES) Method
TL;DR: In this paper, concentrated solar energy (CSE) is applied for soldering and is named as the “Concentrated Solar Energy Soldering (CSES) technique, and lead-free solders are used for comparing novel CSES technique solder joints with CSI (Conventional Soldering Iron) solder joints.
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Effects of gallium, phosphorus and nickel addition in lead-free solders: A review
Pushkaraj D. Sonawane,V.K. Bupesh Raja,K. Palanikumar,Eriki Ananda Kumar,Narayana Aditya,V. Rohit +5 more
TL;DR: In this article, the effect of Gallium, Phosphorus and Nickel addition on solder alloy microstructure and mechanical properties is discussed and compared to lead free solders for last three decades.
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Mechanical properties and corrosion analysis of lead-free Sn–0.7Cu solder CSI joints on Cu substrate
TL;DR: In this paper, lead-free CSI solder joints on Cu Substrate were analyzed and their properties such as tensile strength, bending/flexural strength, and microhardness were studied.