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Open AccessJournal ArticleDOI

Microstructure, Mechanical, and Electrical Properties and Corrosion Analysis of Lead-Free Solder CSI Joints on Cu Substrate Using Novel Concentrated Solar Energy Soldering (CSES) Method

TLDR
In this paper, concentrated solar energy (CSE) is applied for soldering and is named as the “Concentrated Solar Energy Soldering (CSES) technique, and lead-free solders are used for comparing novel CSES technique solder joints with CSI (Conventional Soldering Iron) solder joints.
Abstract
In this study, “Concentrated Solar Energy (CSE)” is applied for soldering and is named as the “Concentrated Solar Energy Soldering (CSES) technique.” Lead-free solders are used for comparing novel CSES technique solder joints with CSI (Conventional Soldering Iron) solder joints. Tensile strength, bending/flexural strength, microhardness, electrical resistivity, fractography, optical microstructures, SEM microstructures, and EDS analysis were used to compare CSES solder joints with CSI solder joints. The salt spray test (SST) was used for corrosion analysis of CSES and CSI solder joints. Experimental results reveal that the tensile response, bending strength, and microhardness of the CSES solder joints were almost equal to those of the CSI solder joints. It was observed that after corrosion, the tensile strength, bending strength, and microhardness for CSES and CSI solder joints reduced. CSES solder joints were found to be slightly better than CSI solder joints for electrical resistivity. Electrical resistivity for all the cases studied was found to increase slightly after corrosion. Interfacial integrity and effect of corrosion were clearly observed on CSES and CSI solder joint microstructures. The intermetallic compounds (IMC) formed in case of CSES solder joints were found to be having slightly less thickness than that of CSI solder joints. The results demonstrate CSES technique as a green technology and a potential substitute to the CSI method.

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Citations
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Journal ArticleDOI

Effects of gallium, phosphorus and nickel addition in lead-free solders: A review

TL;DR: In this article, the effect of Gallium, Phosphorus and Nickel addition on solder alloy microstructure and mechanical properties is discussed and compared to lead free solders for last three decades.
Journal ArticleDOI

Mechanical properties and corrosion analysis of lead-free Sn–0.7Cu solder CSI joints on Cu substrate

TL;DR: In this paper, lead-free CSI solder joints on Cu Substrate were analyzed and their properties such as tensile strength, bending/flexural strength, and microhardness were studied.
Book ChapterDOI

Eco-friendly Soldering Technique

TL;DR: In this paper, the authors used a Fresnel lens accompanied by a two-axis sun tracker to concentrate the solar energy needed for soldering, which can be used to solder on-site electronics apparatuses used in nuclear, space, automobiles, computer hardware, etc.
Journal ArticleDOI

A Novel Approach on the Advancement in Polymer Phase Change Material in Solar Energy

TL;DR: In this paper , a novel approach on the advancement of nanoconfined phase change material is defined along with the application of the solar energy system, and a plethora of reviews and reports have been published to compile the diverse range of polymer phase PCMs made available for various applications.
Journal ArticleDOI

Microstructure, mechanical properties and corrosion analysis of Sn–0.7Cu + Ga solders joints developed using green concentrated solar energy soldering method

TL;DR: In this paper, concentrated solar energy soldering (CSES) technique is applied for soldering newly developed Gallium added Sn-0.7Cu Lead-Free solder and evaluated with CSI (Conventional Soldering Iron) solder joints.
References
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A review of solar thermal technologies

TL;DR: This paper reviews the present day solar thermal technologies and performance analyses of existing designs, mathematical simulation, design and fabrication of innovative designs with suggested improvements have been discussed.
Journal ArticleDOI

A review : On the development of low melting temperature Pb-free solders

TL;DR: This review discusses fundamental research activity and its focus on the solidification and interfacial reactions of Sn-based solder systems, and first explains the reactions between common base materials, coatings, and metallisations, and then proceed to more complex systems with additional alloying elements.
Journal ArticleDOI

A review of lead-free solders for electronics applications

TL;DR: New lead-free solder alternatives and the trends in the industry are reviewed, including SnCu-based solders, SnAgCu solders with Ag content, and Sn3.0Ag0.5Cu (SAC305) solders.
Journal ArticleDOI

Structure and properties of lead-free solders bearing micro and nano particles

TL;DR: In this paper, a systematic review of the development of these lead-free composite solders is given, which hopefully may find applications in microbumps to be used in the future 3D IC technology.
BookDOI

Microjoining and Nanojoining

Y. Zhou
TL;DR: A comprehensive overview of the fundamental aspects of micro-joining processes and techniques can be found in this paper, where the authors provide a valuable reference for production engineers, designers and researchers using or studying microjoining technologies in such industries as microelectronics and biomedical engineering.
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