We present a comprehensive, up-to-date compilation of band parameters for the technologically important III–V zinc blende and wurtzite compound semiconductors: GaAs, GaSb, GaP, GaN, AlAs, AlSb, AlP, AlN, InAs, InSb, InP, and InN, along with their ternary and quaternary alloys. Based on a review of the existing literature, complete and consistent parameter sets are given for all materials. Emphasizing the quantities required for band structure calculations, we tabulate the direct and indirect energy gaps, spin-orbit, and crystal-field splittings, alloy bowing parameters, effective masses for electrons, heavy, light, and split-off holes, Luttinger parameters, interband momentum matrix elements, and deformation potentials, including temperature and alloy-composition dependences where available. Heterostructure band offsets are also given, on an absolute scale that allows any material to be aligned relative to any other.

Band parameters for III–V compound semiconductors and their alloys

Rapid progress in the synthesis and processing of materials with structure on nanometer length scales has created a demand for greater scientific understanding of thermal transport in nanoscale devices, individual nanostructures, and nanostructured materials. This review emphasizes developments in experiment, theory, and computation that have occurred in the past ten years and summarizes the present status of the field. Interfaces between materials become increasingly important on small length scales. The thermal conductance of many solid–solid interfaces have been studied experimentally but the range of observed interface properties is much smaller than predicted by simple theory. Classical molecular dynamics simulations are emerging as a powerful tool for calculations of thermal conductance and phonon scattering, and may provide for a lively interplay of experiment and theory in the near term. Fundamental issues remain concerning the correct definitions of temperature in nonequilibrium nanoscale systems. Modern Si microelectronics are now firmly in the nanoscale regime—experiments have demonstrated that the close proximity of interfaces and the extremely small volume of heat dissipation strongly modifies thermal transport, thereby aggravating problems of thermal management. Microelectronic devices are too large to yield to atomic-level simulation in the foreseeable future and, therefore, calculations of thermal transport must rely on solutions of the Boltzmann transport equation; microscopic phonon scattering rates needed for predictive models are, even for Si, poorly known. Low-dimensional nanostructures, such as carbon nanotubes, are predicted to have novel transport properties; the first quantitative experiments of the thermal conductivity of nanotubes have recently been achieved using microfabricated measurement systems. Nanoscale porosity decreases the permittivity of amorphous dielectrics but porosity also strongly decreases the thermal conductivity. The promise of improved thermoelectric materials and problems of thermal management of optoelectronic devices have stimulated extensive studies of semiconductor superlattices; agreement between experiment and theory is generally poor. Advances in measurement methods, e.g., the 3ω method, time-domain thermoreflectance, sources of coherent phonons, microfabricated test structures, and the scanning thermal microscope, are enabling new capabilities for nanoscale thermal metrology.

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Nanoscale thermal transport

The present invention provides stretchable, and optionally printable, semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Stretchable semiconductors and electronic circuits of the present invention preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention may be adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

http://science.sciencemag.org/content/sci/311/5758/208.full.pdf

Stretchable form of single crystal silicon for high performance electronics on rubber substrates

The present invention provides methods, systems and system components for transferring, assembling and integrating features and arrays of features having selected nanosized and/or microsized physical dimensions, shapes and spatial orientations. Methods of the present invention utilize principles of ‘soft adhesion’ to guide the transfer, assembly and/or integration of features, such as printable semiconductor elements or other components of electronic devices. Methods of the present invention are useful for transferring features from a donor substrate to the transfer surface of an elastomeric transfer device and, optionally, from the transfer surface of an elastomeric transfer device to the receiving surface of a receiving substrate. The present methods and systems provide highly efficient, registered transfer of features and arrays of features, such as printable semiconductor element, in a concerted manner that maintains the relative spatial orientations of transferred features.

Pattern Transfer Printing by Kinetic Control of Adhesion to an Elastomeric Stamp

The present invention provides device components geometries and fabrication strategies for enhancing the electronic performance of electronic devices based on thin films of randomly oriented or partially aligned semiconducting nanotubes. In certain aspects, devices and methods of the present invention incorporate a patterned layer of randomly oriented or partially aligned carbon nanotubes, such as one or more interconnected SWNT networks, providing a semiconductor channel exhibiting improved electronic properties relative to conventional nanotubes-based electronic systems.

Medium scale carbon nanotube thin film integrated circuits on flexible plastic substrates

Infrared photoluminescence (PL) from InSb, InAs, and InAs1−xSbx (x<0.3) epitaxial layers grown by atmospheric pressure organometallic vapor phase epitaxy has been investigated for the first time over an extended temperature range. The values of full width at half maximum of the PL peaks show that the epitaxial layer quality is comparable to that grown by molecular‐beam epitaxy. The observed small peak shift with temperature for most InAs1−xSbx epilayers may be explained by wave‐vector‐nonconserving transitions involved in the PL emission. For comparison, PL spectra from InSb/InSb and InAs/InAs show that the wave‐vector‐conserving mechanism is responsible for the PL emission. The temperature dependence of the energy band gaps, Eg, in InSb and InAs is shown to follow Varshni’s equation Eg(T)=Eg0−αT2/ (T+β). The empirical constants are calculated to be Eg0=235 meV, α=0.270 meV/K, and β=106 K for InSb and Eg0=415 meV, α=0.276 meV/K, and β=83 K for InAs.

Photoluminescence of InSb, InAs, and InAsSb grown by organometallic vapor phase epitaxy.

Interfacial elastic strain induced by the lattice parameter mismatch between epilayer and substrate results in significant energy–band‐gap shifts for III‐V alloys. The epilayers used in this study are GaxIn1−xAs on (100) InP and GaxIn1−xP on (100) GaAs prepared by organometallic vapor phase epitaxy. For layer thicknesses between 1 and 1.5 μm, and Δas.f./a0≤3.5×10−3 the misfit strain is assumed to be accommodated elastically. The energy–band‐gap shifts are determined by comparing the photoluminescence peak energies of the epilayers with the best experimental relation of band gap versus composition for unstrained layers. A calculation of the energy–band‐gap shift due to biaxial stress made for GaxIn1−xAs is found to agree with the photoluminescence measurements. In addition, a comparison of the energy–band‐gap shift for GaxIn1−xP shows a clearly different dependency for tensile and compressive strain, in good agreement with calculated results.

Effect of mismatch strain on band gap in III‐V semiconductors

The system GaAs1−xSbx has a solid phase miscibility gap ranging from x = 0.2 to x = 0.8 at the typical growth temperature of 600 C; however, metastable alloys covering this entire composition range have been grown by organometallic vapor phase epitaxy (OMVPE) using trimethylgallium, antimony and -arsenic as the source materials. The solid composition is studied for various values of growth temperature, the ratio of Sb to total group V elements in the vapor phase and the ratio of group III to group V elements in the vapor phase. The fraction of trimethylarsenic (TMAs) pyrolyzed in the vapor phase is found to be < 1 and to vary with temperature. Taking into account the incomplete pyrolysis of TMAs, solid composition is found to be controlled by thermodynamics. The effects of temperature and vapor composition are all accurately predicted using a simple thermodynamic model assuming equilibrium to be established at the solid-vapor interface. The properties of these metastable GaAs1−x Sbx alloys were explored using interference contrast microscopy, room temperature and 4 K photoluminescence, Hall effect and conductivity measurements. The alloy GaAs0.5Sb0.5 grown lattice matched to the InP substrate has excellent surface morphology, is p-type, and the photoluminescence spectrum consists of a single, intense, fairly broad (23.5 meV half width) peak at a wavelength of 1.54 Μm.

GaAs1−xSbx growth by OMVPE

InAs1−xBix with x≤0.026 and InAs1−x−ySbyBix with x≤0.017 and y≤0.096 have been successfully grown on InAs (100) oriented substrates by atmospheric pressure organometallic vapor phase epitaxy using the precursors trimethylindium, trimethylbismuth, trimethylantimony, and arsine. Good surface morphologies for both InAsBi and InAsSbBi epitaxial layers were obtained at a growth temperature of 400 °C. A key growth parameter is the V/III ratio. Only a very narrow range near 4 (considering the incomplete pyrolysis of AsH3) yields smooth InAsBi epilayers. Typical growth rates were 0.02 μm/min. X‐ray diffractometer scans show clearly resolved Kα1 and Kα2 peaks for the layer of InAs0.889Sb0.096Bi0.015 grown on an InAs substrate with a graded transition layer to accommodate the lattice parameter difference. The half widths of the peaks are comparable to those of the substrate. For the first time, photoluminescence (PL) at 10 K from these Bi‐containing alloys has been measured. The PL peak energy is seen to decrease w...

R. M. Cohen

Papers

Photoluminescence of InSb, InAs, and InAsSb grown by organometallic vapor phase epitaxy.

Effect of mismatch strain on band gap in III‐V semiconductors

GaAs1−xSbx growth by OMVPE

Organometallic vapor phase epitaxial growth and characterization of InAsBi and InAsSbBi

OMVPE growth of InP using TMIn