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Robert S Averback

Researcher at University of Illinois at Urbana–Champaign

Publications -  392
Citations -  16124

Robert S Averback is an academic researcher from University of Illinois at Urbana–Champaign. The author has contributed to research in topics: Ion & Irradiation. The author has an hindex of 61, co-authored 388 publications receiving 15047 citations. Previous affiliations of Robert S Averback include University at Albany, SUNY & Urbana University.

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Time resolved measurements of melting and solidification in Si using third harmonic generation of light

TL;DR: In this article, the melting and solidification measurements of (001) Si using third harmonic generation (THG) were performed with sub-picosecond time resolution, and it was shown that the THG signal is sensitive to specimen temperature.

Sinter-forging of nanocrystalline TiO2

TL;DR: In this paper, the activation enthalpy measured is consisted with a grain boundary diffusion limited process, whereas the stress exponent found excludes simple diffusional creep, and it is shown that the threshold stress can be explained in terms of the creation of additional surface area due to grain boundary sliding.
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Thermal and radiation-enhanced diffusion in Cu 3 Au

TL;DR: In this article, thermal and radiation-enhanced diffusion in thin films of the order-disorder alloy Cu{sub 3}Au have been analyzed above and below the transition temperature, showing that thin films grown by molecular beam epitaxy are uniquely suited for such experiments as the surface provides a dominant and well-characterized sink for migrating defects.
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First transmission electron microscopy observation of latent tracks in a metallic compound

TL;DR: In this paper, the authors observed discontinuous tracks in a crystalline nickel-zirconium ordered alloy irradiated at 80 K by 3 GeV uranium ions, and the diameter of the tracks is of about 3 nm and their number is close to the number of incoming ions.
Journal ArticleDOI

Sinter-Forging of Nanocrystalline TiO2

TL;DR: In this article, the activation enthalpy measured is consisted with a grain boundary diffusion limited process, whereas the stress exponent found excludes simple diffusional creep, and it is shown that the threshold stress can be explained in terms of the creation of additional surface area due to grain boundary sliding.