Learn the basic properties and designs of modern VLSI devices, as well as the factors affecting performance, with this thoroughly updated second edition. The first edition has been widely adopted as a standard textbook in microelectronics in many major US universities and worldwide. The internationally-renowned authors highlight the intricate interdependencies and subtle tradeoffs between various practically important device parameters, and also provide an in-depth discussion of device scaling and scaling limits of CMOS and bipolar devices. Equations and parameters provided are checked continuously against the reality of silicon data, making the book equally useful in practical transistor design and in the classroom. Every chapter has been updated to include the latest developments, such as MOSFET scale length theory, high-field transport model, and SiGe-base bipolar devices.

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Fundamentals of Modern VLSI Devices

The goal of this paper is to review in brief the basic physics of single-election devices, as well as their-current and prospective applications. These devices based on the controllable transfer of single electrons between small conducting "islands", have already enabled several important scientific experiments. Several other applications of analog single-election devices in unique scientific instrumentation and metrology seem quite feasible. On the other hand, the prospect of silicon transistors being replaced by single-electron devices in integrated digital circuits faces tough challenges and remains uncertain. Nevertheless, even if this replacement does not happen, single electronics will continue to play an important role by shedding light on the fundamental size limitations of new electronic devices. Moreover, recent research in this field has generated some by-product ideas which may revolutionize random-access-memory and digital-data-storage technologies.

Single-electron devices and their applications

This paper mainly focuses on the development of the NOR flash memory technology, with the aim of describing both the basic functionality of the memory cell used so far and the main cell architecture consolidated today. The NOR cell is basically a floating-gate MOS transistor, programmed by channel hot electron and erased by Fowler-Nordheim tunneling. The main reliability issues, such as charge retention and endurance, are discussed, together with an understanding of the basic physical mechanisms responsible. Most of these considerations are also valid for the NAND cell, since it is based on the same concept of floating-gate MOS transistor. Furthermore, an insight into the multilevel approach, where two bits are stored in the same cell, is presented. In fact, the exploitation of the multilevel approach at each technology node allows an increase of the memory efficiency, almost doubling the density at the same chip size, enlarging the application range and reducing the cost per bit. Finally, NOR flash cell scaling issues are covered, pointing out the main challenges. Flash cell scaling has been demonstrated to be really possible and to be able to follow Moore's law down to the 130-nm technology generations. Technology development and consolidated know-how is expected to sustain the scaling trend down to 90- and 65-nm technology nodes. One of the crucial issues to be solved to allow cell scaling below the 65-nm node is the tunnel oxide thickness reduction, as tunnel thinning is limited by intrinsic and extrinsic mechanisms.

Introduction to flash memory

Failure modes and mechanisms of AlGaN/GaN high-electron-mobility transistors are reviewed. Data from three de-accelerated tests are presented, which demonstrate a close correlation between failure modes and bias point. Maximum degradation was found in "semi-on" conditions, close to the maximum of hot-electron generation which was detected with the aid of electroluminescence (EL) measurements. This suggests a contribution of hot-electron effects to device degradation, at least at moderate drain bias (VDS 30-50 V), new failure mechanisms are triggered, which induce an increase of gate leakage current. The latter is possibly related with the inverse piezoelectric effect leading to defect generation due to strain relaxation, and/or to localized permanent breakdown of the AlGaN barrier layer. Results are compared with literature data throughout the text.

Reliability of GaN High-Electron-Mobility Transistors: State of the Art and Perspectives

Many semiconductor quantum devices utilize a novel tunneling transport mechanism that allows picosecond device switching speeds The negative differential resistance characteristic of these devices, achieved due to resonant tunneling, is also ideally suited for the design of highly compact, self-latching logic circuits As a result, quantum device technology is a promising emerging alternative for high-performance very-large-scale-integration design The bistable nature of the basic logic gates implemented using resonant tunneling devices has been utilized in the development of a gate-level pipelining technique, called nanopipelining, that significantly improves the throughput and speed of pipelined systems The advent of multiple-peak resonant tunneling diodes provides a viable means for efficient design of multiple-valued circuits with decreased interconnect complexity and reduced device count as compared to multiple-valued circuits in conventional technologies This paper details various circuit design accomplishments in the area of binary and multiple-valued logic using resonant tunneling diodes (RTD's) in conjunction with high-performance III-V devices such as heterojunction bipolar transistors (HBT's) and modulation doped field-effect transistors (MODFET's) New bistable logic families using RTD+HBT and RTD+MODFET gates are described that provide a single-gate, self-latching majority function in addition to basic NAND, NOR, and inverter gates

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Digital circuit applications of resonant tunneling devices

Recent advances in the area of quantum functional devices are discussed. After a discussion of the functional device concept, resonant-tunneling bipolar transistors (RTBTs) with a double barrier in the base region are described. Design considerations for RTBTs with ballistic injection and the first observation of minority-electron ballistic RT are presented. RTBTs using thermionic injection and exhibiting a high peak-to-valley ratio at room temperature in the transfer characteristics are also described. Multiple-state RTBTs and their DC and microwave performance are then discussed. Circuit applications of RTBTs also are discussed. It is shown that RTBTs allow the implementation of many analog and digital circuit functions with a greatly reduced number of transistors and show considerable promise for multiple-valued logic. Experimental results on frequency multipliers and parity bit generators are presented. Analog-to-digital converters are memory circuits are also discussed. Two novel superlattice-base transistors are reported. Negative transconductance is achieved by suppression of injection into minibands. Gated quantum-well RT transistors are also discussed. >

Quantum functional devices: resonant-tunneling transistors, circuits with reduced complexity, and multiple valued logic

Carbon doping of GaAs grown by molecular beam epitaxy has been obtained for the first time by use of a heated graphite filament. Controlled carbon acceptor concentrations over the range of 10 to the 17th-10 to the 20th/cu cm were achieved by resistively heating a graphite filament with a direct current power supply. Capacitance-voltage, p/n junction and secondary-ion mass spectrometry measurements indicate that there is negligible diffusion of carbon during growth and with postgrowth rapid thermal annealing. Carbon was used for p-type doping in the base of Npn AlGaAs/GaAs heterojunction bipolar transistors. Current gains greater than 100 and near-ideal emitter heterojunctions were obtained in transistors with a carbon base doping of 1 x 10 to the 19th/cu cm. These preliminary results indicate that carbon doping from a solid graphite source may be an attractive substitute for beryllium, which is known to have a relatively high diffusion coefficient in GaAs.

Carbon doping in molecular beam epitaxy of GaAs from a heated graphite filament

A simple procedure has been used to determine the optimum emitter grading for a heterojunction bipolar transistor (ABT). Use of this procedure allows maximum hole confinement in addition to minimum base/emitter turn‐on voltage, leading to a negligible collector/emitter offset voltage, both of which are necessary for high performance devices. By using a parabolic grading function at the emitter/base junction a Np+n Ga0.7Al0.3As/GaAs HBT has been fabricated, using molecular beam epitaxy, with a negligible collector/emitter offset voltage. A similar result can be obtained with a N‐i emitter where the undoped i region is linearly graded.

Optimum emitter grading for heterojunction bipolar transistors

We report the first compositionally graded base bipolar transistor The device grown by MBE incorporates a wide gap Al035Ga065As emitter (n = 2 × 1016/cm3 and a 04 μm thick p+ (= 2 × 1018/cm3)base graded from Al020Ga080As to GaAs DC current gain of 35 with flat, nearly ideal, collector characteristics are observed Incorporation of a graded gap base gives much faster base transit times due to the induced quasi-electric field for electrons, thus allowing a precious tradeoff against the base resistance

Bipolar transistor with graded band-gap base

In suitably designed superlattice structures hot carriers in the barrier layers can collide with carriers confined or dynamically stored in the wells and impact ionize them out, across the band‐edge discontinuity. Photomultiplication and spectral response measurements as a function of temperature and chopping frequency in Al0.48 In0.52 As/Ga0.47 In0.53As and AlSb/GaSb superlattices provide strong evidence of this effect. The observed phenomenon is characterized by a large ratio of the multiplication factors for holes and electrons implying that β≫α and can be the basis for a new class of very low noise avalanche photodiodes and solid‐state photomultipliers.

Roger J. Malik

Papers

Quantum functional devices: resonant-tunneling transistors, circuits with reduced complexity, and multiple valued logic

Carbon doping in molecular beam epitaxy of GaAs from a heated graphite filament

Optimum emitter grading for heterojunction bipolar transistors

Bipolar transistor with graded band-gap base

New avalanche multiplication phenomenon in quantum well superlattices: Evidence of impact ionization across the band‐edge discontinuity