S. Groth

TL;DR: In this paper, an integrated interferometer based on a simple coherent matter-wave beam splitter constructed on an atom chip is presented, where the authors demonstrate the splitting of Bose-Einstein condensates into two clouds separated by distances ranging from 3 to 80μm.

TL;DR: This work uses one-dimensional Bose–Einstein condensates in a microscopic field-imaging technique that combines high spatial resolution (within 3 micrometres) with high field sensitivity (300 picotesla).

Abstract: Neutral atoms can be trapped and manipulated with surface mounted microscopic current carrying and charged structures. We present a lithographic fabrication process for such atom chips based on evaporated metal films. The size limit of this process is below 1 μm. At room temperature, thin wires can carry current densities of more than 107A∕cm2 and voltages of more than 500 V. Extensive test measurements for different substrates and metal thicknesses (up to 5 μm) are compared to models for the heating characteristics of the microscopic wires. Among the materials tested, we find that Si is the best suited substrate for atom chips.

TL;DR: In this paper, one-dimensional Bose-Einstein condensates brought close to microfabricated wires on an atom chip are demonstrated to be very sensitive sensor for magnetic and electric fields reaching a sensitivity to potential variations of ∼10−14eV at 3μm spatial resolution.

TL;DR: In this article, the authors present a lithographic fabrication process for atom chips based on evaporated metal films, which can carry more than 10$^7$A/cm$^2$ current density and voltages of more than 500V.