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Samuel Clark Ligon

Researcher at Swiss Federal Laboratories for Materials Science and Technology

Publications -  14
Citations -  3097

Samuel Clark Ligon is an academic researcher from Swiss Federal Laboratories for Materials Science and Technology. The author has contributed to research in topics: Photopolymer & Polymerization. The author has an hindex of 8, co-authored 14 publications receiving 2058 citations. Previous affiliations of Samuel Clark Ligon include Vienna University of Technology & University of Vienna.

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Polymers for 3D Printing and Customized Additive Manufacturing

TL;DR: Polymers are by far the most utilized class of materials for AM and their design, additives, and processing parameters as they relate to enhancing build speed and improving accuracy, functionality, surface finish, stability, mechanical properties, and porosity are addressed.
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Strategies to Reduce Oxygen Inhibition in Photoinduced Polymerization

TL;DR: Type II triplet quenching of aryl thiols was found to be dependent on the sensitizer, viscosity, and hydrogen-donating capability of the monomer and on the presence of oxygen.
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A Straightforward Synthesis and Structure−Activity Relationship of Highly Efficient Initiators for Two-Photon Polymerization

TL;DR: In this article, a series of linear and cyclic benzylidene ketone-based two-photon initiators containing double bonds and dialkylamino groups were synthesized in one step via classical aldol condensation reactions.
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Efficient stabilization of thiol-ene formulations in radical photopolymerization

TL;DR: The photo-initiated thiol-ene step growth radical polymerization was first suggested by Posner in 1905, but academic interest in this potential polymerization reaction remained fairly limited until the last two decades as discussed by the authors.
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Hierarchically Porous Materials from Layer-by-Layer Photopolymerization of High Internal Phase Emulsions

TL;DR: The hybrid HIPE-AMT technique provides hierarchically porous materials with mechanical properties tailored by the addition of thiol chain transfer agent, which is sufficient enough to withstand in-mold curing or computer-controlled layer-by-layer stereolithography without phase separation.