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Shanshan Xu

Researcher at University of Colorado Boulder

Publications -  15
Citations -  634

Shanshan Xu is an academic researcher from University of Colorado Boulder. The author has contributed to research in topics: Heat transfer & Condensation. The author has an hindex of 9, co-authored 15 publications receiving 400 citations. Previous affiliations of Shanshan Xu include University of Michigan.

Papers
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Microfabricated ultra-thin all-polymer thermal ground planes

TL;DR: In this article, a flexible thermal ground plane (FTGP) was fabricated using polymer materials and an ultra-thin TiO2 film was deposited over the SU-8 and Kapton via atomic layer deposition, which acted as both a moisture barrier and a hydrophilic coating on polymer surfaces.
Journal ArticleDOI

Development of Ultra-Thin Thermal Ground Planes by Using Stainless-Steel Mesh as Wicking Structure

TL;DR: In this paper, a thermal ground plane (TGP) with a total thickness of 0.28 mm was proposed for thermal management of thickness-constrained microsystems.
Journal ArticleDOI

Optimized Silicon Electrode Architecture, Interface, and Microgeometry for Next-Generation Lithium-Ion Batteries.

TL;DR: The incorporation of 1D silicon nanowires into the cyclized-polyacrylonitrile-based electrode-architecture allows for greatly improved active material utilization, higher rate capabilities, and reduced interfacial reactions.
Patent

Vacuum-enhanced heat spreader

TL;DR: In this article, the authors described a heat spreader with a first layer having a thickness less than about 300 microns, a plurality of pillars disposed on the first layer and arrayed in a pattern, where each of the plurality had a height of less than 100 microns.