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Shintaro Sato

Researcher at Fujitsu

Publications -  142
Citations -  2946

Shintaro Sato is an academic researcher from Fujitsu. The author has contributed to research in topics: Graphene & Carbon nanotube. The author has an hindex of 27, co-authored 125 publications receiving 2743 citations. Previous affiliations of Shintaro Sato include National Institute of Advanced Industrial Science and Technology.

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Origin of the relatively low transport mobility of graphene grown through chemical vapor deposition

TL;DR: The reasons for the relatively low transport mobility of graphene grown through chemical vapor deposition (CVD-G), which include point defect, surface contamination, and line defect, were analyzed and the effect of grain boundary on transport mobility was qualitatively explained using a potential barrier model.
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Electrical Properties of Carbon Nanotube Bundles for Future Via Interconnects

TL;DR: In this paper, a carbon nanotube (CNT) vias consisting of about 1000 tubes using thermal chemical vapor deposition (CVD) at a growth temperature of 450°C with cobalt catalysts, titanium carbide ohmic contacts, and tantalum barrier layers on copper wiring was developed.
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Self-organization of novel carbon composite structure: Graphene multi-layers combined perpendicularly with aligned carbon nanotubes

TL;DR: In this paper, a novel carbon composite structure consisiting of graphene multi-layers and aligned multi-walled carbon nanotubes (MWNTs) has been discovered, which is expected to have excellent electrical and thermal properties, and therefore is likely to find many applications in electronics.
Proceedings Article

Low-resistance multi-walled carbon nanotube vias with parallel channel conduction of inner shells

TL;DR: In this paper, the structure of the interface between MWNTs and Ti bottom contact layers was optimized to obtain a via resistance of 0.7 k/spl Omega/ per MWNT, indicating that most of the inner shells contribute to carrier conduction as an additional channel.
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Low temperature grown carbon nanotube interconnects using inner shells by chemical mechanical polishing

TL;DR: In this article, the electrical properties of MWCNT-via structures with and without chemical mechanical polishing (CMP) were measured for wiring application, and the improved resistance after annealing at 400°C was 0.6Ω for 2μm vias.