We survey progress over the past 25 years in the development of microscale devices for pumping fluids. We attempt to provide both a reference for micropump researchers and a resource for those outside the field who wish to identify the best micropump for a particular application. Reciprocating displacement micropumps have been the subject of extensive research in both academia and the private sector and have been produced with a wide range of actuators, valve configurations and materials. Aperiodic displacement micropumps based on mechanisms such as localized phase change have been shown to be suitable for specialized applications. Electroosmotic micropumps exhibit favorable scaling and are promising for a variety of applications requiring high flow rates and pressures. Dynamic micropumps based on electrohydrodynamic and magnetohydrodynamic effects have also been developed. Much progress has been made, but with micropumps suitable for important applications still not available, this remains a fertile area for future research.

https://microfluidics.stanford.edu/Publications/Micropumps_Cooling/Laser%20Review%20of%20Micropumps%20in%20JMM.pdf

A review of micropumps

Part I: Background and Fundamentals Introduction, Mohamed Gad-el-Hak, University of Notre Dame Scaling of Micromechanical Devices, William Trimmer, Standard MEMS, Inc., and Robert H. Stroud, Aerospace Corporation Mechanical Properties of MEMS Materials, William N. Sharpe, Jr., Johns Hopkins University Flow Physics, Mohamed Gad-el-Hak, University of Notre Dame Integrated Simulation for MEMS: Coupling Flow-Structure-Thermal-Electrical Domains, Robert M. Kirby and George Em Karniadakis, Brown University, and Oleg Mikulchenko and Kartikeya Mayaram, Oregon State University Liquid Flows in Microchannels, Kendra V. Sharp and Ronald J. Adrian, University of Illinois at Urbana-Champaign, Juan G. Santiago and Joshua I. Molho, Stanford University Burnett Simulations of Flows in Microdevices, Ramesh K. Agarwal and Keon-Young Yun, Wichita State University Molecular-Based Microfluidic Simulation Models, Ali Beskok, Texas A&M University Lubrication in MEMS, Kenneth S. Breuer, Brown University Physics of Thin Liquid Films, Alexander Oron, Technion, Israel Bubble/Drop Transport in Microchannels, Hsueh-Chia Chang, University of Notre Dame Fundamentals of Control Theory, Bill Goodwine, University of Notre Dame Model-Based Flow Control for Distributed Architectures, Thomas R. Bewley, University of California, San Diego Soft Computing in Control, Mihir Sen and Bill Goodwine, University of Notre Dame Part II: Design and Fabrication Materials for Microelectromechanical Systems Christian A. Zorman and Mehran Mehregany, Case Western Reserve University MEMS Fabrication, Marc J. Madou, Nanogen, Inc. LIGA and Other Replication Techniques, Marc J. Madou, Nanogen, Inc. X-Ray-Based Fabrication, Todd Christenson, Sandia National Laboratories Electrochemical Fabrication (EFAB), Adam L. Cohen, MEMGen Corporation Fabrication and Characterization of Single-Crystal Silicon Carbide MEMS, Robert S. Okojie, NASA Glenn Research Center Deep Reactive Ion Etching for Bulk Micromachining of Silicon Carbide, Glenn M. Beheim, NASA Glenn Research Center Microfabricated Chemical Sensors for Aerospace Applications, Gary W. Hunter, NASA Glenn Research Center, Chung-Chiun Liu, Case Western Reserve University, and Darby B. Makel, Makel Engineering, Inc. Packaging of Harsh-Environment MEMS Devices, Liang-Yu Chen and Jih-Fen Lei, NASA Glenn Research Center Part III: Applications of MEMS Inertial Sensors, Paul L. Bergstrom, Michigan Technological University, and Gary G. Li, OMM, Inc. Micromachined Pressure Sensors, Jae-Sung Park, Chester Wilson, and Yogesh B. Gianchandani, University of Wisconsin-Madison Sensors and Actuators for Turbulent Flows. Lennart Loefdahl, Chalmers University of Technology, and Mohamed Gad-el-Hak, University of Notre Dame Surface-Micromachined Mechanisms, Andrew D. Oliver and David W. Plummer, Sandia National Laboratories Microrobotics Thorbjoern Ebefors and Goeran Stemme, Royal Institute of Technology, Sweden Microscale Vacuum Pumps, E. Phillip Muntz, University of Southern California, and Stephen E. Vargo, SiWave, Inc. Microdroplet Generators. Fan-Gang Tseng, National Tsing Hua University, Taiwan Micro Heat Pipes and Micro Heat Spreaders, G. P. "Bud" Peterson, Rensselaer Polytechnic Institute Microchannel Heat Sinks, Yitshak Zohar, Hong Kong University of Science and Technology Flow Control, Mohamed Gad-el-Hak, University of Notre Dame) Part IV: The Future Reactive Control for Skin-Friction Reduction, Haecheon Choi, Seoul National University Towards MEMS Autonomous Control of Free-Shear Flows, Ahmed Naguib, Michigan State University Fabrication Technologies for Nanoelectromechanical Systems, Gary H. Bernstein, Holly V. Goodson, and Gregory L. Snider, University of Notre Dame Index

The MEMS Handbook

The aim of microfluidic mixing is to achieve a thorough and rapid mixing of multiple samples in microscale devices. In such devices, sample mixing is essentially achieved by enhancing the diffusion effect between the different species flows. Broadly speaking, microfluidic mixing schemes can be categorized as either “active”, where an external energy force is applied to perturb the sample species, or “passive”, where the contact area and contact time of the species samples are increased through specially-designed microchannel configurations. Many mixers have been proposed to facilitate this task over the past 10 years. Accordingly, this paper commences by providing a high level overview of the field of microfluidic mixing devices before describing some of the more significant proposals for active and passive mixers.

/pdf/microfluidic-mixing-a-review-3egj61w5ox.pdf

Microfluidic Mixing: A Review

Three-dimensional (3D) integrated circuits (ICs), which contain multiple layers of active devices, have the potential to dramatically enhance chip performance, functionality, and device packing density. They also provide for microchip architecture and may facilitate the integration of heterogeneous materials, devices, and signals. However, before these advantages can be realized, key technology challenges of 3D ICs must be addressed. More specifically, the processes required to build circuits with multiple layers of active devices must be compatible with current state-of-the-art silicon processing technology. These processes must also show manufacturability, i.e., reliability, good yield, maturity, and reasonable cost. To meet these requirements, IBM has introduced a scheme for building 3D ICs based on the layer transfer of functional circuits, and many process and design innovations have been implemented. This paper reviews the process steps and design aspects that were developed at IBM to enable the formation of stacked device layers. Details regarding an optimized layer transfer process are presented, including the descriptions of 1) a glass substrate process to enable through-wafer alignment; 2) oxide fusion bonding and wafer bow compensation methods for improved alignment tolerance during bonding; 3) and a single-damascene patterning and metallization method for the creation of high-aspect-ratio (6:1 108 vias/cm2), and extremely aggressive wafer-to-wafer alignment (submicron) capability.

Three-dimensional integrated circuits

Monolithic elastomer membrane valves and diaphragm pumps suitable for large-scale integration into glass microfluidic analysis devices are fabricated and characterized. Valves and pumps are fabricated by sandwiching an elastomer membrane between etched glass fluidic channel and manifold wafers. A three-layer valve and pump design features simple non-thermal device bonding and a hybrid glass-PDMS fluidic channel; a four-layer structure includes a glass fluidic system with minimal fluid-elastomer contact for improved chemical and biochemical compatibility. The pneumatically actuated valves have

Monolithic membrane valves and diaphragm pumps for practical large-scale integration into glass microfluidic devices

Electroosmotic flow (EOF) micropumps which use electroosmosis to transport liquids have been fabricated and used to achieve pressures in excess of 20 atm and flow rates of 3.6 μl/min for 2 kV applied potentials. These pumps use deionized water as working fluids in order to reduce the ion current of the pump during operation and increase thermodynamic efficiency. EOF pumps are fabricated by packing the 3.5 μm diameter non-porous silica particles into 500–700 μm diameter fused-silica capillaries and by using a silicate frit fabrication process to hold the particles in place. The devices have no moving parts and can operate as both open (high flow rate) and closed (high pressure) systems. Pressure versus flow rate performance data are presented and combined with measurements of physical dimensions, dry and wet weight, and ion current to calculate the pump structure porosity, tortuosity, effective pore radius, and zeta potential.

Fabrication and characterization of electroosmotic micropumps

Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These electroosmotic pumps are preferably fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These electroosmotic pumps also preferably allow for recapture of evolved gases and deposited materials, which may provide for long-term closed-loop operation. Apparatus and methods according to the present invention also allow active regulation of the temperature of the device through electrical control of the flow through the pump and can utilize multiple cooling loops to allow independent regulation of the special and temporal characteristics of the device temperature profiles. Novel microchannel structures are also described.

Electroosmotic microchannel cooling system

An analytical model for electroosmotic flow rate, total pump current, and thermodynamic efficiency reported in a previous paper has been applied as a design guideline to fabricate porous-structure EO pumps. We have fabricated sintered-glass EO pumps that provide maximum flow rates and pressure capacities of 33 ml/min and 1.3 atm, respectively, at applied potential 100 V. These pumps are designed to be integrated with two-phase microchannel heat exchangers with load capacities of order 100 W and greater. Experiments were conducted with pumps of various geometries and using a relevant, practical range of working electrolyte ionic concentration. Characterization of the pumping performance are discussed in the terms of porosity, tortuosity, pore size, and the dependence of zeta potential on bulk ion density of the working solution. The effects of pressure and flow rate on pump current and thermodynamic efficiency are analyzed and compared to the model prediction. In particular, we explore the important tradeoff between increasing flow rate capacity and obtaining adequate thermodynamic efficiency. This research aims to demonstrate the performance of EOF pump systems and to investigate optimal and practical pump designs. We also present a gas recombination device that makes possible the implementation of this pumping technology into a closed-flow loop where electrolytic gases are converted into water and reclaimed by the system.

/pdf/porous-glass-electroosmotic-pumps-design-and-experiments-52ockowzul.pdf

Porous glass electroosmotic pumps: design and experiments.

Electroosmotic flow (EOF) pumps with flow rates on the order of 1 ml/min have been designed and fabricated. These pumps use EOF to propel liquid solutions in a compact system with no moving parts. The pumping chamber is filled with densely packed non-porous silica particles, and the particle bed is held in place using two polymeric porous frits. The pump frame is made of acrylic, the frits are made using UV photopolymerization within the custom-built acrylic frame, and the particles are packed using a novel side-bore packing technology. Platinum wire electrodes on both sides of the pump provide the electric field to drive the flow. Deionized water is used as a working fluid in order to minimize Joule heating and increase thermodynamic efficiency. The maximum flow rates and maximum pressures generated by the pumps are 0.8 ml/min and 2 atm, respectively, at 1.0 kV applied voltage. # 2002 Elsevier Science B.V. All rights reserved.

/pdf/electroosmotic-flow-pumps-with-polymer-frits-4isqb1tpma.pdf

Electroosmotic flow pumps with polymer frits

Electroosmotic pumps have been prepared using macroporous polymer monoliths with their pore surface grafted with the ionizable monomers 2-acrylamido-2-methyl-1-propanesulfonic acid and [2-(methacryloyloxy)ethyl]trimethyl ammonium chloride, respectively. The effects of critical parameters such as pore size of the monolith, percentage of ionizable moieties in the grafted layer, crosslinking density, and driving voltage on both flow rate and pressure have been quantified. Electroosmotic pumps fabricated from the grafted monoliths afforded pressures as high as 0.38 MPa and electric-field-specific flow rates of up to 0.41 ml/min, both at an applied potential of 50 V.

/pdf/high-pressure-electroosmotic-pumps-based-on-porous-polymer-1h3722pepj.pdf

Shulin Zeng

Papers

Fabrication and characterization of electroosmotic micropumps

Electroosmotic microchannel cooling system

Porous glass electroosmotic pumps: design and experiments.

Electroosmotic flow pumps with polymer frits

High-pressure electroosmotic pumps based on porous polymer monoliths