Part I: Background and Fundamentals Introduction, Mohamed Gad-el-Hak, University of Notre Dame Scaling of Micromechanical Devices, William Trimmer, Standard MEMS, Inc., and Robert H. Stroud, Aerospace Corporation Mechanical Properties of MEMS Materials, William N. Sharpe, Jr., Johns Hopkins University Flow Physics, Mohamed Gad-el-Hak, University of Notre Dame Integrated Simulation for MEMS: Coupling Flow-Structure-Thermal-Electrical Domains, Robert M. Kirby and George Em Karniadakis, Brown University, and Oleg Mikulchenko and Kartikeya Mayaram, Oregon State University Liquid Flows in Microchannels, Kendra V. Sharp and Ronald J. Adrian, University of Illinois at Urbana-Champaign, Juan G. Santiago and Joshua I. Molho, Stanford University Burnett Simulations of Flows in Microdevices, Ramesh K. Agarwal and Keon-Young Yun, Wichita State University Molecular-Based Microfluidic Simulation Models, Ali Beskok, Texas A&M University Lubrication in MEMS, Kenneth S. Breuer, Brown University Physics of Thin Liquid Films, Alexander Oron, Technion, Israel Bubble/Drop Transport in Microchannels, Hsueh-Chia Chang, University of Notre Dame Fundamentals of Control Theory, Bill Goodwine, University of Notre Dame Model-Based Flow Control for Distributed Architectures, Thomas R. Bewley, University of California, San Diego Soft Computing in Control, Mihir Sen and Bill Goodwine, University of Notre Dame Part II: Design and Fabrication Materials for Microelectromechanical Systems Christian A. Zorman and Mehran Mehregany, Case Western Reserve University MEMS Fabrication, Marc J. Madou, Nanogen, Inc. LIGA and Other Replication Techniques, Marc J. Madou, Nanogen, Inc. X-Ray-Based Fabrication, Todd Christenson, Sandia National Laboratories Electrochemical Fabrication (EFAB), Adam L. Cohen, MEMGen Corporation Fabrication and Characterization of Single-Crystal Silicon Carbide MEMS, Robert S. Okojie, NASA Glenn Research Center Deep Reactive Ion Etching for Bulk Micromachining of Silicon Carbide, Glenn M. Beheim, NASA Glenn Research Center Microfabricated Chemical Sensors for Aerospace Applications, Gary W. Hunter, NASA Glenn Research Center, Chung-Chiun Liu, Case Western Reserve University, and Darby B. Makel, Makel Engineering, Inc. Packaging of Harsh-Environment MEMS Devices, Liang-Yu Chen and Jih-Fen Lei, NASA Glenn Research Center Part III: Applications of MEMS Inertial Sensors, Paul L. Bergstrom, Michigan Technological University, and Gary G. Li, OMM, Inc. Micromachined Pressure Sensors, Jae-Sung Park, Chester Wilson, and Yogesh B. Gianchandani, University of Wisconsin-Madison Sensors and Actuators for Turbulent Flows. Lennart Loefdahl, Chalmers University of Technology, and Mohamed Gad-el-Hak, University of Notre Dame Surface-Micromachined Mechanisms, Andrew D. Oliver and David W. Plummer, Sandia National Laboratories Microrobotics Thorbjoern Ebefors and Goeran Stemme, Royal Institute of Technology, Sweden Microscale Vacuum Pumps, E. Phillip Muntz, University of Southern California, and Stephen E. Vargo, SiWave, Inc. Microdroplet Generators. Fan-Gang Tseng, National Tsing Hua University, Taiwan Micro Heat Pipes and Micro Heat Spreaders, G. P. "Bud" Peterson, Rensselaer Polytechnic Institute Microchannel Heat Sinks, Yitshak Zohar, Hong Kong University of Science and Technology Flow Control, Mohamed Gad-el-Hak, University of Notre Dame) Part IV: The Future Reactive Control for Skin-Friction Reduction, Haecheon Choi, Seoul National University Towards MEMS Autonomous Control of Free-Shear Flows, Ahmed Naguib, Michigan State University Fabrication Technologies for Nanoelectromechanical Systems, Gary H. Bernstein, Holly V. Goodson, and Gregory L. Snider, University of Notre Dame Index

The MEMS Handbook

Because of the low dimensional power of its force scaling law, surface tension is appropriate for carrying out reshaping and assembly in the microstructure size domain. This paper reviews work on surface tension powered self-assembly of microstructures. The existing theoretical approaches for rotational assembly are unified. The demonstrated fabrication processes are compared. Mechanisms for accurately determining the assembled shape are discussed, and the limits on accuracy and structural distortion are considered. Applications in optics, electronics and mechanics are described. More complex operations (including the combination of self-assembly and self-organization) are also reviewed.

Surface tension-powered self-assembly of microstructures - the state-of-the-art

Preface. Microelectromechanical Systems (MEMS) and Radio Frequency MEMS. MEMS Materials and Fabrication Techniques. RF MEMS Switches and Micro Relays. MEMS Inductors and Capacitors. Micromachined RF Filters. Micromachined Phase Shifters. Micromachined Transmission Lines and Components. Micromachined Antennae. Integration and Packaging for RF MEMS Devices. Index.

RF MEMS and their applications

An integrally packaged integrated circuit device including an integrated circuit die including a crystalline substrate having first and second generally planar surfaces and edge surfaces and an active surface formed on the first generally planar surface, at least one chip scale packaging layer formed over the active surface and at least one electrical contact formed over the at least one chip scale packaging layer, the at least one electrical contact being connected to circuitry on the active surface by at least one pad formed on the first generally planar surface.

Methods and apparatus for packaging integrated circuit devices

A packaged semiconductor chip includes features such as a chip carrier having a large thermal conductor which can be solder-bonded to a circuit board so as to provide enhanced thermal conductivity to the circuit board and electromagnetic shielding and a conductive enclosure which partially or completely surrounds the packaged chip to provide additional heat dissipation and shielding. The packaged unit may include both an active semiconductor chip and a passive element, desirably in the form of a chip, which includes resistors and capacitors. Inductors may be provided in whole or in part on the chip carrier. A module includes two circuits and an enclosure with a medial wall between the circuits to provide electromagnetic shielding between the circuits.

High-frequency chip packages

This paper presents an acceleration-threshold sensor fabricated with an electroplating technology which can be integrated on top of a pre-processed CMOS signal processing circuit. The device can be manufactured using a standard low-cost CMOS production line and then adding the mechanical sensor elements via a specialized back-end process. This makes the system especially interesting for automotive applications, such as airbag safety systems or transportation shock monitoring systems, where smaller size, improved functionality, high reliability and low costs are important.

https://iopscience.iop.org/article/10.1088/0960-1317/10/2/304/pdf

Additive electroplating technology as a post-CMOS process for the production of MEMS acceleration-threshold switches for transportation applications

This paper presents an additive integration technology for fabrication of MEMS with an electroplating technology on top of a CMOS signal processing circuit. It reports on the development of an inertial sensor-array device for automotive applications and shock-monitoring systems. This device can be manufactured using a low-cost CMOS production line and adding the mechanical sensor elements via a specialized back-end process. The basic fabrication process for the additive electroplating technology and a first device for inertial sensing was reported by the group at MME'97 [T. Tonnesen, O. Ludtke, J. Noetzel, J. Binder, G. Mader, Simulation, design and fabrication of electroplated acceleration switches, J. Micromech. Microeng. 7 (1997) 237–239.]. The additive electroplating technology represents a new alternative to other devices realized with bulk and surface micromachining as described, e.g., in Analog Devices [Analog Devices, Monolithic accelerometer with signal conditioning ADXL50, Application Notes, 1995.]. This paper concentrates on improvements in the fabrication technology and the development of the wafer-level capping and back-end packaging sequence for a sensor-array device, which can be manufactured within an industrial processing line.

Low-cost post-CMOS integration of electroplated microstructures for inertial sensing

This paper reports a new surface micromachined torsional actuator for integrated microswitches. The device requires an actuation voltage below 10 V and is fabricated in a BiCMOS compatible process, allowing for monolithic integration with an actuation circuitry. Insensitivity against mechanical vibrations is achieved by a bistable operation principle. Measured pull-in voltages of the structures are in good agreement with the electromechanical simulations. The dynamic behavior of the actuator is investigated by interferometric determination of the resonance modes. Measurements of the switching times of completed devices result in values below 10 μs.

A low-voltage torsional actuator for application in RF-microswitches

An acceleration threshold sensor fabricated with an electroplating technology on top of a CMOS signal processing circuit is presented in this paper. Manufacturing of the device is achieved using a standard low-cost CMOS production line and employing a specialized back-end process for adding the mechanical sensor-elements. This production technology makes the system especially interesting for automotive applications in airbag systems or transportation shock monitoring systems. These applications demand smaller size, improved functionality, high reliability and low costs, factors that can be satisfied with this new technology. The initial additive electroplating technology (AET) has been improved by coating the basic structures with an electroplated alloy. Additionally, a specialized packaging procedure has been developed to hermetically seal the sensor-structures following their release after the sacrificial layer removal. The devices are finally SMD-packaged to allow for easy handling. Samples of the device have been tested extensively and have successfully proven its functionality.

Acceleration threshold switches from an additive electroplating MEMS process

Applications ranging from hearing aids over communication to noise cancellation open up a high volume market for low‐cost, batch producible and reliable microphones. To obey these conditions, a single‐chip capacitive microphone has been developed at Siemens, utilizing a modified standard CMOS process with adjacent bulk micromachining. In a first step, the microphone is integrated with a source follower, enabling low output impedance of the signal. The technology allows for the future integration of advanced circuitry. The microphone consists of an acoustically sensitive polycrystalline silicon membrane and a highly perforated back‐plate as the counter electrode. To achieve highly sensitive devices, special emphasis was given to the stress of the polycrystalline silicon membrane, which should be slightly tensile. Another key issue during the fabrication and in operation is to prevent stiction of the sensitive membrane. Since the overall chip size is below 3‐mm side length, surface mounting in low‐cost SMD packages is possible.

Sven Michaelis

Papers

Additive electroplating technology as a post-CMOS process for the production of MEMS acceleration-threshold switches for transportation applications

Low-cost post-CMOS integration of electroplated microstructures for inertial sensing

A low-voltage torsional actuator for application in RF-microswitches

Acceleration threshold switches from an additive electroplating MEMS process

Silicon micromachined microphone chip at Siemens