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Theo J. Frot
Researcher at IBM
Publications - 20
Citations - 1403
Theo J. Frot is an academic researcher from IBM. The author has contributed to research in topics: Dielectric & Titanium. The author has an hindex of 10, co-authored 20 publications receiving 1166 citations. Previous affiliations of Theo J. Frot include Pierre-and-Marie-Curie University & Collège de France.
Papers
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Journal ArticleDOI
A New Photoactive Crystalline Highly Porous Titanium(IV) Dicarboxylate
M. Dan‐Hardi,Christian Serre,Theo J. Frot,Laurence Rozes,Guillaume Maurin,Clément Sanchez,Gérard Férey +6 more
TL;DR: MIL-125, the first example of a highly porous and crystalline titanium(IV) dicarboxylate with a high thermal stability and photochemical properties, is presented, a very promising candidate for applications in smart photonic devices, sensors, and catalysis.
Journal ArticleDOI
Application of the Protection/Deprotection Strategy to the Science of Porous Materials
TL;DR: It is shown that the porous structure can be fi lled with an organic polymer, which then acts as a protective agent during the various aggressive processing steps, and it is believed that this protection strategy will facilitate the integration of materials at k < 2.4 in future electronic devices.
Journal ArticleDOI
Atmospheric plasma deposited dense silica coatings on plastics.
Linying Cui,Alpana N. Ranade,Marvi A. Matos,Liam S. Cavanaugh Pingree,Theo J. Frot,Geraud Dubois,Geraud Dubois,Reinhold H. Dauskardt +7 more
TL;DR: The optimum combinations of Young's modulus and adhesion were achieved with the high boiling point precursor which produced coatings with high Young'sModulus and good adhesion compared to commercial polysiloxane hard coatings on plastics.
Journal ArticleDOI
Post Porosity Plasma Protection: Scaling of Efficiency with Porosity
Theo J. Frot,Willi Volksen,Sampath Purushothaman,Robert L. Bruce,Teddie Magbitang,Dolores C. Miller,Vaughn R. Deline,Geraud Dubois +7 more
TL;DR: In this paper, the porosity of oxycarbosilane dielectrics is increased to lower the interconnect signal delay and enable manufacturing of lower power consumption and higher performance microprocessors.
Patent
Homogeneous porous low dielectric constant materials
TL;DR: In this article, a structure having a first layer overlying a substrate, where the first layer includes a dielectric material having a plurality of pores, is provided, and a filling material is applied to an exposed surface of the first-layer, which is then removed by heating the structure to a second temperature to decompose the filling material.