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Thomas F. Kuech

Researcher at University of Wisconsin-Madison

Publications -  640
Citations -  13102

Thomas F. Kuech is an academic researcher from University of Wisconsin-Madison. The author has contributed to research in topics: Epitaxy & Metalorganic vapour phase epitaxy. The author has an hindex of 55, co-authored 638 publications receiving 12426 citations. Previous affiliations of Thomas F. Kuech include Corning Inc. & Pennsylvania State University.

Papers
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Journal ArticleDOI

Interdiffusion of Al and Ga in (Al,Ga)As/GaAs Quantum Wells

TL;DR: In this article, photoluminescence spectroscopy was employed to determine the interdiffusion of Al and Ga in (Al,Ga)As/GaAs quantum wells.
Journal ArticleDOI

Instrument for in situ hard x-ray nanobeam characterization during epitaxial crystallization and materials transformations.

TL;DR: In this paper, an in situ synchrotron hard x-ray instrument was used to study the structural and chemical properties of solid-phase epitaxy (SPE) and other three-dimensional epitaxial crystallization processes.
Journal ArticleDOI

New Growth Chemistries and Techniques in Metal-Organic Vapor Phase Epitaxy

Thomas F. Kuech
- 01 Jan 1988 - 
TL;DR: The metal-organic vapor phase epitaxy (MOVPE) technique is perhaps the most versatile of the conventional III-V growth epitaxial systems as mentioned in this paper, which stems from the wide variety of chemical precursors available for the growth and doping of the films.
Proceedings Article

Characteristics of step-graded In x Ga 1−x As and InGaP y Sb 1−y metamorphic buffer layers on GaAs substrates

TL;DR: In this article, a post growth Chemical-Mechanical Polishing (CMP) procedure is implemented to reduce the surface roughness of the In x Ga 1−x As MBL.
Patent

Method of making single crystal gallium nitride

TL;DR: In this article, a method of making a single crystal Ga*N article is described, including the steps of: providing a substrate (20) of crystalline material having a surface (16) which is epitaxially compatible with Ga *N; depositing a layer of single-crystalline Ga * N (26) over the surface of the substrate; and etchably removing the substrate from the layer of Ga* N, to yield the layer.