T
Thomas R. Miller
Researcher at IBM
Publications - 34
Citations - 663
Thomas R. Miller is an academic researcher from IBM. The author has contributed to research in topics: Printed circuit board & Layer (electronics). The author has an hindex of 15, co-authored 34 publications receiving 661 citations. Previous affiliations of Thomas R. Miller include GlobalFoundries.
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Patent
Manufacturing method of circuit board which has solder paste connection part
Norman A. Card,Thomas R. Miller,William J. Rudik,ジェイ. ルディック ウイリアム,アール. ミラー トーマス,エー. カード ノーマン +5 more
TL;DR: In this paper, a manufacturing method of a circuit board assembly in which the conductor pads of two auxiliary circuit boards are electrically connected with sure is presented, and the manufacturing method includes a process (1) in which first and second auxiliary circuit board are supplied, a process(2) matching by making metal conductor pads face each other, an opening in the insulation board having an opening is arranged between the two auxiliary boards, and a solder paste of appropriate amount is attached to at least one of a pair of metal conductor pad.
Patent
Method of making a printed wiring board with conformally plated circuit traces
TL;DR: In this article, a commoning layer of copper is applied over a catalyzed surface of the board substrate and the circuit lines, followed by a gold layer electrodeposited over the nickel in close registry therewith.
Patent
Method of fabricating a BGA package having decreased adhesion
TL;DR: Ball Grid Array packages having decreased adhesion of the BGA pad to the laminate surface and methods for producing the same are provided in this article, where a method for producing BGA packages with increased adhesion to laminate surfaces is described.
Patent
Method for producing an electronic package possessing controlled impedance characteristics
TL;DR: A method for creating an impedance controlled printing wiring board, particularly the formation of a structure for high speed printed wiring boards incorporating multiple differential impedance controlled layers, is described in this paper.