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Thomas Wieder

Researcher at Technische Universität Darmstadt

Publications -  55
Citations -  549

Thomas Wieder is an academic researcher from Technische Universität Darmstadt. The author has contributed to research in topics: Residual stress & Lattice constant. The author has an hindex of 9, co-authored 55 publications receiving 513 citations. Previous affiliations of Thomas Wieder include Technion – Israel Institute of Technology & Darmstadt University of Applied Sciences.

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An interface clusters mixture model for the structure of amorphous silicon monoxide (SiO)

TL;DR: In this paper, the authors reviewed the state of the art on the structure of amorphous silicon monoxide (SiO) using diffraction, microscopy, spectroscopy, and magnetometry methods.
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Residual stresses in alumina-SiC nanocomposites

TL;DR: In this article, the residual stresses in an alumina-SiC particulate composite were studied as a function of SiC content by X-ray diffraction, and the average microstresses in each phase and the stress fluctuations in the matrix were evaluated from a combination of Xray reflection shift and line broadening analysis.
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Calculation of thermally induced strains in thin films of any crystal class

TL;DR: In this article, a model is presented to calculate the reflection shifts caused by a biaxial strain state in a thin film composed of a material of any crystal class, taking into account the elastic anisotropy of the film material.
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Reflectometry studies of the oxidation kinetics of thin copper films

TL;DR: In this article, a power-law dependence of the oxide layer thickness was found, and activation energy obtained is weakly time dependent, and the reflectometry and diffractometry data indicated the formation of Cu2O.
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Microstructure analysis of ohmic contacts on MBE grown n-GaSb and investigation of sub-micron contacts

TL;DR: In this paper, the thermally induced solid state interdiffusion of Au Ge Pd and Pd ohmic contacts on MBE grown n-GaSb was investigated and the electrical behavior of these contacts for different contact sizes down to 540 nm in diameter was compared.