A method for fabricating a semiconductor device, in which a lifting phenomenon can be prevented from occurring in forming an amorphous carbon film on an etched layer having tensile stress. According to the invention, since a compression stress on the etched layer or the amorphous carbon film can be reduced or a compression stress film is formed between the etched layer or the amorphous carbon film to prevent a lifting phenomenon from occurring and thus another pattern can be formed to fabricate a highly integrated semiconductor device.

Method for Fabricating Semiconductor Device

A semiconductor device includes a via structure and a conductive structure. The via structure has a surface with a planar portion and a protrusion portion. The conductive structure is formed over at least part of the planar portion and not over at least part of the protrusion portion of the via structure. For example, the conductive structure is formed only onto the planar portion and not onto any of the protrusion portion for forming high quality connection between the conductive structure and the via structure.

Semiconductor Device and Method of Fabricating the Same

A method for fabricating a semiconductor device includes forming a recess gate over a semiconductor substrate. A gate spacer is formed on a sidewall of the recess gate. The semiconductor substrate in a landing plug contact region is soft-etched to form a recess having a rounded profile. A sidewall spacer is formed over the gate spacer and a sidewall of the recess. An insulating film is formed over the semiconductor substrate. The insulating film is selectively etched to form a landing plug contact hole. A conductive layer in the landing plug contact hole is filled to form a landing plug.

Semiconductor Device and Method for Fabricating the Same

This paper reviews electrostatic discharge (ESD) investigations on laterally diffused MOS (LDMOS) and drain-extended MOS (DeMOS) devices. The limits of the safe operating area of LDMOS/DeMOS devices and device physics under ESD stress are discussed under various biasing conditions and layout schemes. Specifically, the root cause of early filament formation is highlighted. Differences in filamentary nature among various LDMOS/DeMOS devices are shown. Based on the physical understanding, device optimization guidelines are given. Finally, an outlook on technology scaling is presented.

A Review on the ESD Robustness of Drain-Extended MOS Devices

A semiconductor structure. The semiconductor structure includes a semiconductor substrate, a first transistor on the semiconductor substrate, and a guard ring on the semiconductor substrate. The semiconductor substrate includes a top substrate surface which defines a reference direction perpendicular to the top substrate surface. The guard ring includes a semiconductor material doped with a doping polarity. A first doping profile of a first doped transistor region of the first transistor in the reference direction and a second doping profile of a first doped guard-ring region of the guard ring in the reference direction are essentially a same doping profile. The guard ring forms a closed loop around the first transistor.

Guard ring structures for high voltage CMOS/low voltage CMOS technology using LDMOS (lateral double-diffused metal oxide semiconductor) device fabrication

A new high-voltage-tolerant power-rail electrostatic discharge (ESD) clamp circuit with a special ESD detection circuit realized with only 1timesVDD devices for 3timesVDD-tolerant mixed-voltage I/O interfaces is proposed. The proposed power-rail ESD clamp circuit with excellent ESD protection effectiveness has been verified in a 0.13-mum CMOS process with only 1.2-V devices.

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Design of High-Voltage-Tolerant Power-Rail ESD Clamp Circuit in Low-Voltage CMOS Processes

The dependences of device structures and layout parameters on ESD robustness in a 40-V CMOS process have been investigated in silicon chips. From the experimental results, the high-voltage (HV) MOSFETs without drift implant in the drain region have better TLP-measured It2 and ESD robustness than those with drift implant in the drain region. Furthermore, the It2 and ESD level of HV MOSFETs can be increased as the layout spacing from the drain diffusion to polygate is increased.

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ESD Robustness of 40-V CMOS Devices With/Without Drift Implant

Provided is a metal oxide semiconductor device, including a substrate, a gate, a first-type first heavily doped region, a first-type drift region, a second-type first heavily doped region, a contact, a first electrode, and a second electrode. The gate is disposed on the substrate. The first-type first heavily doped region is disposed in the substrate at a side of the gate. The first-type drift region is disposed in the substrate at another side of the gate. The second-type first heavily doped region is disposed in the first-type drift region. The contact is electrically connected to the second-type first heavily doped region. The contact is the closest contact to the gate on the first-type drift region. The first electrode is electrically connected to the contact, and the second electrode is electrically connected to the first-type first heavily doped region and the gate.

Metal oxide semiconductor device

An N-LDMOS ESD protection device with drain back and PESD optimization design is proposed. With PESD layer enclosing the N+ drain region, a parasitic SCR is created to achieve high ESD level. When PESD is close to gate, the turn-on efficiency can be further improved (Vt1: 11.2 V reduced to 7.2 V) by the punch-through path from N+/PESD to PW. The proposed ESD N-LDMOS can sustain over 8KV HBM with low trigger behavior without extra area cost.

Optimization of PESD implant design for ESD robustness of 5V drain-back N-LDMOSFET

Provided is a lateral BJT including a substrate, a well region, an area, at least one lightly doped region, a first doped region, and a second doped region The substrate is of a first conductivity type The well region is of a second conductivity type and is in the substrate The area is in the well region The at least one lightly doped region is in the well region below the area The first doped region and the second doped region are of the first conductivity type and are in the well region on both sides of the area The first doped region is connected to a cathode The second doped region is connected to an anode, wherein the doping concentration of the at least one lightly doped region is lower than that of each of the first doped region, the second doped region, and the well region

Tien-Hao Tang

Papers

Design of High-Voltage-Tolerant Power-Rail ESD Clamp Circuit in Low-Voltage CMOS Processes

ESD Robustness of 40-V CMOS Devices With/Without Drift Implant

Metal oxide semiconductor device

Optimization of PESD implant design for ESD robustness of 5V drain-back N-LDMOSFET

Lateral bipolar junction transistor and fabrication method thereof