T
Timothy H. Daubenspeck
Researcher at IBM
Publications - 129
Citations - 1688
Timothy H. Daubenspeck is an academic researcher from IBM. The author has contributed to research in topics: Layer (electronics) & Flip chip. The author has an hindex of 21, co-authored 129 publications receiving 1688 citations. Previous affiliations of Timothy H. Daubenspeck include GlobalFoundries.
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Patent
Bilayer metallization cap for photolithography
John Robert Abernathey,Timothy H. Daubenspeck,Stephen E. Luce,Denis J Poley,Rosemary A Previti-Kelley,Gary P. Viens,Jung H Yoon +6 more
TL;DR: In this paper, a process of patterning a conductive layer on a substrate avoiding webbing yet permitting high density patterning places two layers between the resist and the metal: the first layer is an antireflective coating such as titanium nitride applied to the metal and the second layer is a barrier comprising silicon such as sputtered silicon or SiO₂.
Patent
Self-aligned pattern over a reflective layer
TL;DR: In this article, an opening in an insulator on a substrate is self-aligned to a reflective region on the substrate, formed by shining blanket radiation on photoresist on the insulator and developing to open the resist and insulator.
Patent
Undercut-free blm process for pb-free and pb-reduced c4
TL;DR: In this paper, a system and method for eliminating undercut when forming a C4 solder bump for BLM (Ball Limiting Metallurgy) and improving the C4 pitch is presented.
Patent
Post-fuse blow corrosion prevention structure for copper fuses
Timothy H. Daubenspeck,Daniel C. Edelstein,Robert M. Geffken,William T. Motsiff,Anthony K. Stamper,Steven H. Voldman +5 more
TL;DR: In this paper, a structural and method of fabricating a semiconductor corrosion resistant metal fuse line including a refractory liner which can also act as a resistive element is disclosed.
Patent
Electrical interconnection structure formation
TL;DR: In this article, the electrical structure comprises a substrate comprising electrically conductive pads and a first dielectric layer over the substrate and the electricallyconductive pads, and a ball limiting metallization layer is formed within the vias.