Patent
Undercut-free blm process for pb-free and pb-reduced c4
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TLDR
In this paper, a system and method for eliminating undercut when forming a C4 solder bump for BLM (Ball Limiting Metallurgy) and improving the C4 pitch is presented.Abstract:
A system and method for eliminating undercut when forming a C4 solder bump for BLM (Ball Limiting Metallurgy) and improving the C4 pitch. In the process, a barrier layer metal stack is deposited above a metal pad layer. A top layer of the barrier layer metals (e.g., Cu) is patterned by CMP with a bottom conductive layer of the barrier metal stack removed by etching. The diffusion barrier and C4 solder bump may be formed by electroless plating, in one embodiment, using a maskless technique, or by an electroplating techniques using a patterned mask. This allows the pitch of the C4 solder bumps to be reduced.read more
Citations
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Mechanisms for forming copper pillar bumps using patterned anodes
TL;DR: In this article, the mechanisms of preparing bump structures described by using patterned anodes may simplify bump-making process, reduce manufacturing cost, and improve thickness uniformity within die and across the wafer.
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TL;DR: In this paper, the conductive structure is formed over at least part of the planar portion and not over the protrusion portion of the via structure of a semiconductor device.
Patent
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TL;DR: In this paper, the authors proposed a metal bump structure to resolve the delamination issues between a conductive layer on a substrate and the metal bump connected to the conductive surface.
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References
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Patent
Method of forming conductive bumps on die for flip chip applications
TL;DR: In this paper, an improved method for forming UBM pads and bump connections for flip chip was proposed, which eliminates at least one mask step required in standard UBM pad forming processes.
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