T
Tsung-Shune Chin
Researcher at National Tsing Hua University
Publications - 6
Citations - 9014
Tsung-Shune Chin is an academic researcher from National Tsing Hua University. The author has contributed to research in topics: Microstructure & Crystallite. The author has an hindex of 3, co-authored 3 publications receiving 5702 citations. Previous affiliations of Tsung-Shune Chin include National United University.
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Journal ArticleDOI
Nanostructured High-Entropy Alloys with Multiple Principal Elements: Novel Alloy Design Concepts and Outcomes
Jien-Wei Yeh,Swe-Kai Chen,Su-Jien Lin,Jon-Yiew Gan,Tsung-Shune Chin,Tsung-Shune Chin,Tao-Tsung Shun,Chun-Huei Tsau,Shou-Yi Chang +8 more
TL;DR: A new approach for the design of alloys is presented in this paper, where high-entropy alloys with multi-principal elements were synthesized using well-developed processing technologies.
Journal ArticleDOI
Formation of simple crystal structures in Cu-Co-Ni-Cr-Al-Fe-Ti-V alloys with multiprincipal metallic elements
Jien-Wei Yeh,Su-Jien Lin,Tsung-Shune Chin,Jon-Yiew Gan,Swe-Kai Chen,Tao-Tsung Shun,Chung-Huei Tsau,Shou-Yi Chou +7 more
TL;DR: In this article, four alloys containing multiprincipal metallic elements (≥5 elements) were prepared by casting, splat quenching, and sputtering, and their microstructures and crystal structures were investigated.
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Residual stress analysis of electrodeposited thick CoMnP monolayers and CoMnP/Cu multilayers
TL;DR: In this article , the authors characterized and compared the residual stresses of mono-and multi-layered configurations using sin2ψ X-ray diffraction (XRD) for the apparent crystallite stress (σXRD), and curvature measurement methods for the macro-stress (σf).
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Microstructure and thermal diffusivity investigations of RF-sputtered tantalum nitride films
TL;DR: In this article, the thermal diffusivity of TaN films was measured using a traveling thermal wave method and the measured values were within the range 0.10-0.15 cm2/s with a deviation ± 0.05 A. The incorporation of oxygen impurity was found not available as examined by transmission electron microscopy (TEM) and X-ray photoelectron spetroscopy (XPS) quantitative analyses.
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Residual stress tuned magnetic properties of thick CoMnP/Cu multilayers
TL;DR: In this article , the authors explored quantitatively magnetic properties of CoMnP/Cu multilayers tuned by σr, which in turn are varied by the inserted soft Cu interlayer and thickness of single Co-mnP magnetic layers.